HD6417706F133 Renesas Electronics America, HD6417706F133 Datasheet - Page 36

• Manufacturer Part Number: HD6417706F133
• Description: IC SUPERH MPU ROMLESS 176LQFP
• Manufacturer: Renesas Electronics America
• Series: SuperH® SH7700r

Specifications of HD6417706F133

• Core Processor: SH-3
• Core Size: 32-Bit
• Speed: 133MHz
• Connectivity: EBI/EMI, FIFO, SCI, SmartCard
• Peripherals: DMA, POR, WDT
• Number Of I /o: 103
• Program Memory Type: ROMless
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.75 V ~ 2.05 V
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 176-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Program Memory Size: -
• Data Converters: -

Section 23 List of Registers
23.1 Register Address Map ....................................................................................................... 585
23.2 Register Bits...................................................................................................................... 591
23.3 Register States in Processing Mode .................................................................................. 602
Section 24 Electrical Characteristics
24.1 Absolute Maximum Ratings ............................................................................................. 607
24.2 DC Characteristics ............................................................................................................ 609
24.3 AC Characteristics ............................................................................................................ 612
24.4 A/D Converter Characteristics .......................................................................................... 664
24.5 D/A Converter Characteristics .......................................................................................... 664
Appendix
A.
B.
C.
D.
Index
Rev. 5.00 May 29, 2006 page xxxiv of xlviii
24.3.1 Clock Timing ....................................................................................................... 612
24.3.2 Control Signal Timing ......................................................................................... 619
24.3.3 AC Bus Timing .................................................................................................... 622
24.3.4 Basic Timing........................................................................................................ 624
24.3.5 Burst ROM Timing .............................................................................................. 627
24.3.6 Synchronous DRAM Timing ............................................................................... 630
24.3.7 PCMCIA Timing ................................................................................................. 647
24.3.8 Peripheral Module Signal Timing........................................................................ 654
24.3.9 H-UDI, AUD Related Pin Timing ....................................................................... 658
24.3.10 A/D Converter Timing......................................................................................... 660
24.3.11 AC Characteristics Measurement Conditions ...................................................... 662
24.3.12 Delay Time Variation Due to Load Capacitance ................................................. 663
Equivalent Circuits of I/O Buffer for Each Pin................................................................. 665
Pin Functions .................................................................................................................... 669
B.1 Pin Functions ........................................................................................................... 669
B.2 Pin Specifications .................................................................................................... 673
B.3 Processing of Unused Pins....................................................................................... 677
B.4 Pin States in Access to Each Address Space............................................................ 678
Product Lineup.................................................................................................................. 692
Package Dimensions ......................................................................................................... 693
.......................................................................................................................................... 695
.................................................................................................................................. 665
.............................................................................................. 585
.............................................................................. 607