WG82577LM S LGWS Intel, WG82577LM S LGWS Datasheet - Page 23

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WG82577LM S LGWS

Manufacturer Part Number
WG82577LM S LGWS
Description
Manufacturer
Intel
Datasheet

Specifications of WG82577LM S LGWS

Lead Free Status / RoHS Status
Supplier Unconfirmed
Package—82577 GbE PHY
4.2
Package Electrical and Thermal Characteristics
The thermal resistance from junction to case, qJC, is 15.1 ×C/Watt.
The thermal resistance from junction to ambient, qJA, is as follows: 4-layer PCB, 85
degrees ambient.
No heat sink is required.
Air Flow (m/s)
0
1
2
Maximum T
119
118
116
J
qJA (×C/Watt)
34
33
31
16

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