TMPM333FDFG Toshiba, TMPM333FDFG Datasheet - Page 461

• Manufacturer Part Number: TMPM333FDFG
• Description: Microcontrollers (MCU) MCU w/ ARM Cortex-M3 512K FLASH, 32K SRAM
• Manufacturer: Toshiba

Specifications of TMPM333FDFG

• Processor Series: TX03
• Core: ARM Cortex M3
• 3rd Party Development Tools: MDK-ARM, RL-ARM, ULINK2
• Product Summaries: Summary
• Lead Free: Yes
• Rohs Compatible Product(s): Available
• Rom (kbytes): 512K
• Rom Type: Flash
• Ram (kbytes): 32K
• Number Of Pins: 100
• Package: LQFP(14×14)
• Vcc: 3V
• Cpu Mhz: 40
• Ssp (ch) Spi: -
• I2c/sio (ch): 3
• Uart/sio (ch): 3
• Usb: -
• Can: -
• Ethernet: -
• External Bus Interface: -
• Cs/wait Controller (ch): -
• Dma Controller: -
• 10-bit Da Converter: -
• 10-bit Ad Converter: 12
• 12-bit Ad Converter: -
• 16-bit Timer / Counter: 10
• Motor / Igbt Control: -
• Real Time Clock: 1
• Watchdog Timer: Y
• Osc Freq Detect: -
• Clock Gear: Y
• Low-power Hold Function: -
• Remote Control Interface: -
• Hardware Cec Controller: -
• Comparators: -
• Low-voltage Detector: -
• Etm Hardware Trace: 4-bit
• Lead Free Status / Rohs Status: Details

17.9
17.9.1
17.9.2
High-speed oscillation
Handling Precaution
must consider the time for the internal regulator and oscillator to be stableIn the .In the TX03, the internal regulator
requires at least 700 μs to be stable.
kept "Low" for a duration of time sufficiently long enough for the internal regulator and oscillator to be stable.
Test parameter
The power supply must be raised (from 0V to 2.7V) at a speed of 0.37ms/V or slower. The power-on sequence
The time required to achieve stable oscillation varies with system. At cold reset, the external reset pin must be
Figure 17-2 shows the power-on sequence.
Solderability
Solderability
Power-on sequence
RVDD3,
DVDD3,
AVDD3
RESET
2.7 V
0 V
Use of Sn-37Pb solder Bath
Solder bath temperature = 230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Figure 17-2 Power-on sequence
0.37ms/V
(min.)
Test condition
Page 441
700 µs(min.)
12 cycle(min.)
Pass:
solderability rate until forming ≥ 95%
TMPM333FDFG/FYFG/FWFG
Note