tmp1941af TOSHIBA Semiconductor CORPORATION, tmp1941af Datasheet - Page 21
tmp1941af
Manufacturer Part Number
tmp1941af
Description
32-bit Tx System Risc
Manufacturer
TOSHIBA Semiconductor CORPORATION
Datasheet
1.TMP1941AF.pdf
(354 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TMP1941AF
Manufacturer:
TOSHIBA
Quantity:
48
Part Number:
tmp1941af(Z)
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
- Current page: 21 of 354
- Download datasheet (5Mb)
3.2
3.2.1
3.2.2
Moisture-proof packing should be handled with care. The handling
procedure specified for each packing type should be followed scrupulously.
If the proper procedures are not followed, the quality and reliability of
devices may be degraded. This section describes general precautions for
handling moisture-proof packing. Since the details may differ from device
to device, refer also to the relevant individual datasheets or databook.
(1) General precautions
Storage
Avoid storage locations where devices will be exposed to moisture or direct sunlight.
Follow the instructions printed on the device cartons regarding
transportation and storage.
The storage area temperature should be kept within a
temperature range of 5°C to 35°C, and relative humidity
should be maintained at between 45% and 75%.
Do not store devices in the presence of harmful (especially
corrosive) gases, or in dusty conditions.
Use storage areas where there is minimal temperature fluctuation. Rapid temperature changes
can cause moisture to form on stored devices, resulting in lead oxidation or corrosion. As a
result, the solderability of the leads will be degraded.
When repacking devices, use anti-static containers.
Do not allow external forces or loads to be applied to devices while they are in storage.
If devices have been stored for more than two years, their electrical characteristics should be
tested and their leads should be tested for ease of soldering before they are used.
Do not drop or toss device packing. The laminated aluminum material in it can be rendered
ineffective by rough handling.
The storage area temperature should be kept within a temperature range of 5°C to 30°C, and
relative humidity should be maintained at 90% (max). Use devices within 12 months of the
date marked on the package seal.
General storage
Moisture-proof packing
Follow the instructions printed on the device cartons regarding transportation and storage.
3 General Safety Precautions and Usage Considerations
9
Humidity:
@ @
Temperature:
Related parts for tmp1941af
Image
Part Number
Description
Manufacturer
Datasheet
Request
R
Part Number:
Description:
Toshiba Semiconductor [TOSHIBA IGBT Module Silicon N Channel IGBT]
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
Toshiba Semiconductor [SILICON N CHANNEL 1GBT]
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
Toshiba Semiconductor [GTR Module Silicon N Channel IGBT High Power Switching Applications Motor Control Applications]
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
Toshiba Semiconductor [Power Module]
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA GTR MODULE SILICON NPN TRIPLE DIFFUSED TYPE
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA GTR Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA Intelligent Power Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA INTELLIGENT POWER MODULE SILICON N CHANNEL LGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA IGBT Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA GTR MODULE SILICON N−CHANNEL IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA Intelligent Power Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA GTR Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA INTELLIGENT POWER MODULE
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA Intelligent Power Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet:
Part Number:
Description:
TOSHIBA Intelligent Power Module Silicon N Channel IGBT
Manufacturer:
TOSHIBA Semiconductor CORPORATION
Datasheet: