PIC16F1829-E/P Microchip Technology, PIC16F1829-E/P Datasheet - Page 351
PIC16F1829-E/P
Manufacturer Part Number
PIC16F1829-E/P
Description
14 KB Flash, 1K Bytes RAM, 32 MHz Int. Osc, 18 I/0, Enhanced Mid Range Core 20 P
Manufacturer
Microchip Technology
Series
PIC® XLP™ mTouch™ 16Fr
Datasheet
1.PIC16LF1829-ISO.pdf
(420 pages)
Specifications of PIC16F1829-E/P
Core Processor
PIC
Core Size
8-Bit
Speed
32MHz
Connectivity
I²C, LIN, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, WDT
Number Of I /o
17
Program Memory Size
14KB (8K x 14)
Program Memory Type
FLASH
Eeprom Size
256 x 8
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
*
Processor Series
PIC16F182x
Core
PIC
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
I2C, SPI, USART
Maximum Clock Frequency
32 MHz
Number Of Programmable I/os
18
Number Of Timers
5
Operating Supply Voltage
1.8 V to 5.5 V
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
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30.0
Absolute Maximum Ratings
Ambient temperature under bias....................................................................................................... -40°C to +125°C
Storage temperature ........................................................................................................................ -65°C to +150°C
Voltage on V
Voltage on V
Voltage on MCLR with respect to Vss ................................................................................................. -0.3V to +9.0V
Voltage on all other pins with respect to V
Total power dissipation
Maximum current out of V
Maximum current out of V
Maximum current into V
Maximum current into V
Clamp current, I
Maximum output current sunk by any I/O pin.................................................................................................... 25 mA
Maximum output current sourced by any I/O pin .............................................................................................. 25 mA
Note 1:
2010 Microchip Technology Inc.
† NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the
device. This is a stress rating only and functional operation of the device at those or any other conditions above those
indicated in the operation listings of this specification is not implied. Exposure above maximum rating conditions for
extended periods may affect device reliability.
ELECTRICAL SPECIFICATIONS
Power dissipation is calculated as follows: P
DD
DD
with respect to V
with respect to V
K
(V
PIN
(1)
DD
DD
< 0 or V
............................................................................................................................... 800 mW
SS
SS
pin, -40°C T
pin, -40°C T
pin, -40°C T
pin, -40°C T
PIN
SS
SS
, PIC16F1825/1829 .................................................................... -0.3V to +6.5V
, PIC16LF1825/1829 .................................................................. -0.3V to +4.0V
> V
(†)
DD
A
A
SS
)20 mA
A
A
+85°C for industrial.................................................................. 800 mA
+125°C for extended ................................................................. 30 mA
+85°C for industrial................................................................. 85 mA
+125°C for extended .............................................................. 35 mA
........................................................................... -0.3V to (V
Preliminary
DIS
= V
DD
PIC16F/LF1825/1829
x {I
DD
– I
OH
} + {(V
DD
– V
OH
) x I
DS41440A-page 353
OH
} + (V
DD
+ 0.3V)
O
l x I
OL
).
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