MT29F8G08ABABAWP:B Micron Technology Inc, MT29F8G08ABABAWP:B Datasheet - Page 14

• Manufacturer Part Number: MT29F8G08ABABAWP:B
• Manufacturer: Micron Technology Inc

Specifications of MT29F8G08ABABAWP:B

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Addressing and Memory Map
Device and Array Organization
Figure 6:
Figure 7:
PDF: 09005aef8386131b / Source: 09005aef838cad98
m61a_async_sync_nand.fm - Rev. A 2/09 EN
Device Organization for Single-Die Package (TSOP/BGA)
Device Organization for Single-Die Package (LGA)
Notes:
1. Signal names not in parentheses are for TSOP packages. Signal names in parentheses are for
NAND Flash devices do not contain dedicated address pins. Addresses are loaded using
a 5-cycle sequence shown in Table 2 on page 23.
I/O[7:0] (DQ[7:0])
BGA packages.
WP# (WP#-1)
ALE (ALE-1)
CLE (CLE-1)
RE# (W/R#)
WE# (CLK)
N/A (DQS)
I/O[7:0]-1
WE#-1
WP#-1
ALE-1
RE#-1
CLE-1
Micron Confidential and Proprietary
CE#
CE#
8Gb Asychronous/Synchronous NAND Flash Memory
Package
Package
14
Target 1
Target 1
LUN 1
LUN 1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Addressing and Memory Map
©2008 Micron Technology, Inc. All rights reserved.
R/B#
R/B#
Advance