STM32W108CBU6 STMICROELECTRONICS [STMicroelectronics], STM32W108CBU6 Datasheet - Page 157

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STM32W108CBU6

Manufacturer Part Number
STM32W108CBU6
Description
High-performance, IEEE 802.15.4 wireless system-on-chip
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet

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STM32W108CB, STM32W108HB
12.2
Absolute maximum ratings
Stresses above the absolute maximum ratings listed in
Table 24: Current
permanent damage to the device. These are stress ratings only and functional operation of
the device at these conditions is not implied. Exposure to maximum rating conditions for
extended periods may affect device reliability.
Table 23.
Table 24.
Table 25.
Regulator input voltage (VDD_PADS)
Analog, Memory and Core voltage (VDD_24MHZ, VDD_VCO,
VDD_RF, VDD_IF, VDD_PADSA, VDD_MEM, VDD_PRE,
VDD_SYNTH, VDD_CORE)
Voltage on RF_P,N; RF_TX_ALT_P,N
RF Input Power (for max level for correct packet reception see
Table 43: Receive
RX signal into a lossless balun
Voltage on any GPIO (PA[7:0], PB[7:0], PC[7:0]), SWCLK,
NRST, VREG_OUT
Voltage on BIAS_R, OSCA, OSCB
ΣI
Symbol
I
INJ(PIN)
INJ(PIN)
Symbol
I
I
VDD
VSS
I
T
IO
STG
T
J
Voltage characteristics
Current characteristics
Thermal characteristics
Total current into V
Total current out of V
Output current sunk by any I/O and control pin
Output current source by any I/Os and control pin
Injected current on NRST pin
Injected current on HSE OSC_IN and LSE OSC_IN pins
Injected current on any other pin
Total injected current (sum of all I/O and control pins)
characteristics)
characteristics, and
Storage temperature range
Maximum junction temperature
Ratings
Doc ID 16252 Rev 2
DD
SS
/V
Ratings
DDA
Table 25: Thermal characteristics
ground lines (sink)
Ratings
power lines (source)
Table 23: Voltage
Min.
-0.3
-0.3
-0.3
-0.3
-0.3
Electrical characteristics
–40 to +140
VDD_PADSA +0.3
VDD_PADS +0.3
Value
150
may cause
characteristics,
Max.
+3.6
+2.0
+3.6
+15
Max.
− 25
± 25
150
150
± 5
± 5
± 5
25
157/179
Unit
Unit
°C
°C
mA
dBm
Unit
V
V
V
V
V

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