STM32W108CBU6 STMICROELECTRONICS [STMicroelectronics], STM32W108CBU6 Datasheet - Page 175

• Manufacturer Part Number: STM32W108CBU6
• Description: High-performance, IEEE 802.15.4 wireless system-on-chip
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

STM32W108CB, STM32W108HB
Figure 54. QFN 40L 6x6mm pitch 0.5 package outline
Table 47.
1. Values in inches are converted from mm and rounded to 4 decimal digits.
A
A1
A2
A3
b
D
D2
E
E2
e
L
ddd
Symbol
Pin 1 ID
Exposed pad
QFN 40L 6x6mm package mechanical data
0.800
0.180
5.900
4.500
4.500
0.350
Min
Bottom view
millimeters
0.900
0.020
0.720
0.200
0.250
6.000
4.550
6.000
4.550
0.500
0.400
Doc ID 16252 Rev 2
Typ
1.000
0.050
1.070
0.300
6.100
4.700
4.700
0.450
0.080
Pin 1 ID
Max
0.0315
0.0071
0.2323
0.1772
0.1772
0.0138
Min
Package characteristics
Top view
inches
0.0354
0.0008
0.0283
0.0079
0.0098
0.2362
0.1791
0.2362
0.1791
0.0197
0.0157
Typ
(1)
0.0394
0.0020
0.0421
0.0118
0.2402
0.1850
0.1850
0.0177
0.0031
Max
ZF_ME
175/179