DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 1029

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
DF2367VF33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Instruction
POP.L ERn
PUSH.W Rn
PUSH.L ERn R:W 2nd R:W
ROTL.B Rd
ROTL.B #2,Rd R:W
ROTL.W Rd
ROTL.W
#2,Rd
ROTL.L ERd
ROTL.L
#2,ERd
ROTR.B Rd
ROTR.B
#2,Rd
ROTR.W Rd
ROTR.W
#2,Rd
ROTR.L ERd R:W
ROTR.L
#2,ERd
ROTXL.B Rd R:W
ROTXL.B
#2,Rd
ROTXL.W Rd R:W
1
R:W 2nd R:W
R:W
NEXT
R:W
NEXT
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
NEXT
R:W
NEXT
NEXT
R:W
NEXT
NEXT
2
NEXT
1 state of
internal
operation
NEXT
3
1 state of
internal
operation
W:W EA
1 state of
internal
operation
4
R:W:M
EA
W:W:M
EA
5
R:W
EA+2
W:W
EA+2
Rev.6.00 Mar. 18, 2009 Page 969 of 980
6
7
REJ09B0050-0600
8
Appendix
9

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