DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 268

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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Section 6 Bus Controller (BSC)
6.10.3
Figure 6.56 shows the timing for transition to the bus released state.
Rev.6.00 Mar. 18, 2009 Page 208 of 980
REJ09B0050-0600
Address bus
HWR, LWR
Data bus
BREQO
BREQ
BACK
RD
AS
[1] Low level of BREQ signal is sampled at rise of φ.
[2] Bus control signal returns to be high at end of external space access cycle.
[3] BACK signal is driven low, releasing bus to external bus master.
[4] BREQ signal state is also sampled in external bus released state.
[5] High level of BREQ signal is sampled.
[6] BACK signal is driven high, ending external bus release cycle.
[7] When there is external access or refresh request of internal bus master during external
[8] Normally BREQO signal goes high 1.5 states after rising edge of BACK signal.
Note: However that if BREQO is asserted by a CBR refresh request, BREQO signal is
φ
Transition Timing
At least one state from sampling of BREQ signal.
bus release while BREQOE bit is set to 1, BREQO signal goes low.
kept low until a CBR refresh cycle starts.
External space
access cycle
T
Figure 6.56 Bus Released State Transition Timing
1
[1]
T
2
[2]
[3]
[4]
[5]
External bus released state
High impedance
High impedance
High impedance
High impedance
High impedance
[6]
[7]
[8]
CPU
cycle

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