DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 313
DF2367VF33
Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.DF2368VTE34V.pdf
(1044 pages)
Specifications of DF2367VF33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33
HD64F2367VF33
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Section 7 DMA Controller (DMAC)
restored in accordance with the values of the DTSZ and DTID bits in DMACR. The MAR
restoration operation is as shown below.
DTID
DTSZ
MAR = MAR – (–1)
· 2
· ETCRH
The same value should be set in ETCRH and ETCRL.
In repeat mode, operation continues until the DTE bit in DMABCRL is cleared. To end the
transfer operation, therefore, the DTE bit should be cleared to 0. A transfer end interrupt request is
not sent to the CPU or DTC. By setting the DTE bit to 1 again after it has been cleared, the
operation can be restarted from the transfer after that terminated when the DTE bit was cleared.
Figure 7.7 illustrates operation in repeat mode.
Rev.6.00 Mar. 18, 2009 Page 253 of 980
REJ09B0050-0600
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