DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 58

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

Section 22 Clock Pulse Generator
Table 22.1
Table 22.2
Table 22.3
Section 23 Power-Down Modes
Table 23.1
Table 23.2
Table 23.3
Section 25 Electrical Characteristics
Table 25.1
Table 25.2
Table 25.3
Table 25.4
Table 25.5
Table 25.6
Table 25.7
Table 25.8
Table 25.9
Table 25.10 Timing of On-Chip Peripheral Modules................................................................. 904
Table 25.11 A/D Conversion Characteristics............................................................................. 910
Table 25.12 D/A Conversion Characteristics............................................................................. 910
Table 25.13 Absolute Maximum Ratings................................................................................... 911
Table 25.14 DC Characteristics (1)............................................................................................ 912
Table 25.15 DC Characteristics (2)............................................................................................ 913
Table 25.16 Permissible Output Currents .................................................................................. 914
Table 25.17 Clock Timing ......................................................................................................... 915
Table 25.18 Control Signal Timing............................................................................................ 916
Table 25.19 Bus Timing (1) ....................................................................................................... 917
Table 25.20 Bus Timing (2) ....................................................................................................... 919
Table 25.21 DMAC Timing ....................................................................................................... 920
Table 25.22 Timing of On-Chip Peripheral Modules................................................................. 921
Table 25.23 A/D Conversion Characteristics............................................................................. 923
Table 25.24 D/A Conversion Characteristics............................................................................. 923
Table 25.25 Flash Memory Characteristics................................................................................ 924
Table 25.26 Absolute Maximum Ratings................................................................................... 926
Table 25.27 DC Characteristics.................................................................................................. 927
Table 25.28 DC Characteristics.................................................................................................. 928
Table 25.29 Permissible Output Currents .................................................................................. 929
Rev.6.00 Mar. 18, 2009 Page lvi of lviii
REJ09B0050-0600
Damping Resistance Value .................................................................................... 816
Crystal Oscillator Characteristics ........................................................................... 817
External Clock Input Conditions............................................................................ 818
Operating Modes and Internal States of the LSI .................................................... 824
Oscillation Stabilization Time Settings .................................................................. 832
φ Pin State in Each Processing State ...................................................................... 836
Absolute Maximum Ratings................................................................................... 873
DC Characteristics (1)............................................................................................ 874
DC Characteristics (2)............................................................................................ 875
Permissible Output Currents .................................................................................. 876
Clock Timing ......................................................................................................... 878
Control Signal Timing............................................................................................ 880
Bus Timing (1) ....................................................................................................... 882
Bus Timing (2) ....................................................................................................... 884
DMAC Timing ....................................................................................................... 901