DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 795
DF2367VF33
Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet
1.DF2368VTE34V.pdf
(1044 pages)
Specifications of DF2367VF33
Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33
HD64F2367VF33
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Section 20 Flash Memory (0.18-μm F-ZTAT Version)
20.3.2
Programming/Erasing Interface Parameter
The programming/erasing interface parameter specifies the operating frequency, storage place for
program data, programming destination address, and erase block and exchanges the processing
result for the downloaded on-chip program. This parameter uses the general registers of the CPU
(ER0 and ER1) or the on-chip RAM area. The initial value is undefined at a power-on reset or in
hardware standby mode.
When download, initialization, or on-chip program is executed, registers of the CPU except for
R0L are stored. The return value of the processing result is written in ER0, ER1. Since the stack
area is used for storing the registers except for ER0, ER1, the stack area must be saved at the
processing start. (A maximum size of a stack area to be used is 128 bytes.)
The programming/erasing interface parameter is used in the following four items.
1. Download control
2. Initialization before programming or erasing
3. Programming
4. Erasing
These items use different parameters. The correspondence table is shown in table 20.4. The
meaning of the bits in FPFR varies in each processing program: initialization, programming, or
erasure. For details, see descriptions of FPFR for each process.
Rev.6.00 Mar. 18, 2009 Page 735 of 980
REJ09B0050-0600
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