DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 231

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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If a row address hold time or read access time is necessary, making a setting in bits RCD1 and
RCD0 in DRACCR allows from one to three T
to be inserted between the T
the column address is output. Use the setting that gives the optimum row address signal hold time
relative to the falling edge of the RAS signal according to the DRAM connected and the operating
frequency of this LSI. Figure 6.23 shows an example of the timing when one T
Read
Write
Note: n = 2, 3
Figure 6.23 Example of Timing with One Row Address Output Maintenance State
φ
Address bus
RASn (CSn)
UCAS, LCAS
WE (HWR)
OE (RD)
Data bus
WE (HWR)
OE (RD)
Data bus
r
cycle, in which the RAS signal goes low, and the T
T
p
(RAST = 0, CAST = 0)
Row address
T
r
rw
states, in which row address output is maintained,
T
Rev.6.00 Mar. 18, 2009 Page 171 of 980
rw
Section 6 Bus Controller (BSC)
High
High
T
Column address
c1
rw
REJ09B0050-0600
c1
state is set.
cycle, in which
T
c2

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