M30802FCGP#D3 Renesas Electronics America, M30802FCGP#D3 Datasheet - Page 303

• Manufacturer Part Number: M30802FCGP#D3
• Description: IC M16C MCU FLASH 128K 144LQFP
• Manufacturer: Renesas Electronics America
• Series: M16C™ M16C/80r

Specifications of M30802FCGP#D3

• Core Processor: M16C/80
• Core Size: 16-Bit
• Speed: 20MHz
• Connectivity: SIO, UART/USART
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 121
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 10K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 5.5 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

M
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31. Parallel I/O Mode
e
E
1
v
J
6
1 .
0
C
Use an exclusive programer supporting M16C/80 (flash memory version).
Refer to the instruction manual of each programer maker for the details of use.
User ROM and Boot ROM Areas
9
0 .
8 /
B
In parallel I/O mode, the user ROM and boot ROM areas shown in Figure 29.3 can be rewritten. Both
areas of flash memory can be operated on in the same way.
Program and block erase operations can be performed in the user ROM area. The user ROM area and its
blocks are shown in Figure 29.3.
The boot ROM area is 8 Kbytes in size. In parallel I/O mode, it is located at addresses 0FFE000
0FFFFFF
range. (Access to any location outside this address range is prohibited.)
In the boot ROM area, an erase block operation is applied to only one 8 Kbyte block. The boot ROM area
has had a standard serial I/O mode control program stored in it when shipped from the factory.
Therefore, using the device in standard serial input/output mode, you do not need to write to the boot
ROM area.
0
0
0
1
A
8
G
u
7
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. g
0 -
u
1
0
p
0
, 2
0
16
2
. Make sure program and block erase operations are always performed within this address
0
0
5
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31. Parallel I/O Mode
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