MC908LJ12CFUE Freescale Semiconductor, MC908LJ12CFUE Datasheet - Page 408

• Manufacturer Part Number: MC908LJ12CFUE
• Description: IC MCU 12K FLASH 4/8MHZ 64-QFP
• Manufacturer: Freescale Semiconductor
• Series: HC08r

Specifications of MC908LJ12CFUE

• Core Processor: HC08
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: IRSCI, SPI
• Peripherals: LCD, LVD, POR, PWM
• Number Of I /o: 32
• Program Memory Size: 12KB (12K x 8)
• Program Memory Type: FLASH
• Ram Size: 512 x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 6x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-QFP
• Processor Series: HC08LJ
• Core: HC08
• Data Bus Width: 8 bit
• Data Ram Size: 512 B
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 32
• Number Of Timers: 4
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: FSICEBASE, M68EML08LJLKE, ZK-HC08LX-A, M68CBL05CE
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 6 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Mechanical Specifications
24.3 52-Pin Low-Profile Quad Flat Pack (LQFP)
Technical Data
408
SEATING
PLANE
–H–
–T–
–L–
Figure 24-1. 52-Pin Low-Profile Quad Flat Pack (Case No. 848D)
C
13
1
4X
52
14
0.20 (0.008) H L–M
S1
C2
A1
C1
VIEW AA
0.05 (0.002)
A
S
3X
–N–
4X
4X
N
VIEW Y
S
2
3
40
26
Mechanical Specifications
Z
39
27
K
E
W
4X 13 TIPS
1
–M–
0.20 (0.008) T L–M
B1
VIEW AA
2X R
V1
GAGE PLANE
0.10 (0.004) T
0.25 (0.010)
R1
B
V
N
C L
PLATING
NOTES:
0.13 (0.005)
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETER.
3. DATUM PLANE –H– IS LOCATED AT BOTTOM OF
4. DATUMS –L–, –M– AND –N– TO BE DETERMINED
5. DIMENSIONS S AND V TO BE DETERMINED AT
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
7. DIMENSION D DOES NOT INCLUDE DAMBAR
ROTATED 90 CLOCKWISE
Y14.5M, 1982.
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING LINE.
AT DATUM PLANE –H–.
SEATING PLANE –T–.
PROTRUSION. ALLOWABLE PROTRUSION IS
0.25 (0.010) PER SIDE. DIMENSIONS A AND B
DO INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLANE –H–.
PROTRUSION. DAMBAR PROTRUSION SHALL
NOT CAUSE THE LEAD WIDTH TO EXCEED 0.46
(0.018). MINIMUM SPACE BETWEEN
PROTRUSION AND ADJACENT LEAD OR
PROTRUSION 0.07 (0.003).
DIM
A1
B1
C1
C2
R1
J
S1
V1
A
B
C
D
G
K
U
W
E
F
J
S
V
Z
SECTION AB–AB
1
2
3
AB
AB
MILLIMETERS
MIN
–––
0.05
1.30
0.20
0.45
0.22
0.07
0.08
0.09
12
12
0
10.00 BSC
10.00 BSC
12.00 BSC
12.00 BSC
0
5.00 BSC
5.00 BSC
0.65 BSC
0.50 REF
6.00 BSC
6.00 BSC
0.20 REF
1.00 REF
MC68HC908LJ12
VIEW Y
M
F
D
REF
REF
MAX
T
–––
1.70
0.20
1.50
0.40
0.75
0.35
0.20
0.20
0.16
7
Freescale Semiconductor
L–M
0.002
0.051
0.008
0.018
0.009
0.003
0.003
0.004
–––
MIN
12
12
0.394 BSC
0.197 BSC
0.394 BSC
0.197 BSC
0.026 BSC
0
0
0.020 REF
0.472 BSC
0.236 BSC
0.472 BSC
0.236 BSC
0.008 REF
0.039 REF
S
INCHES
U
N
REF
BASE METAL
REF
MAX
0.067
0.008
0.059
0.016
0.030
0.014
0.008
0.008
0.006
–––
7
X=L, M, N
S
–X–
G
—
Rev. 2.1