PPC8567EVTAUJJ Freescale Semiconductor, PPC8567EVTAUJJ Datasheet - Page 125

• Manufacturer Part Number: PPC8567EVTAUJJ
• Description: MCU PWRQUICC III 1023-FCPBGA
• Manufacturer: Freescale Semiconductor

Specifications of PPC8567EVTAUJJ

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 1.333GHz
• Voltage: 1.1V
• Mounting Type: Surface Mount
• Package / Case: 1023-BBGA, FCBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

23.5.2
For proper PCI Express operation, the CCB clock frequency must be greater than:
Note that the “PCI Express link width” in the above equation refers to the negotiated link width as the
result of PCI Express link training, which may or may not be the same as the link width POR selection.
For proper Serial RapidIO operation, the CCB clock frequency must be greater than:
For proper PCI operation in synchronous mode, the minimum CCB:SYSCLK ratio is 6:1.
24 Thermal
This section describes the thermal specifications of the MPC8568E.
24.1
Table 87
24.2
This section provides thermal management information for the flip chip plastic ball grid array (FC-PBGA)
package for air-cooled applications. Proper thermal control design is primarily dependent on the
Freescale Semiconductor
Junction-to-ambient Natural Convection on single layer board (1s)
Junction-to-ambient Natural Convection on four layer board (2s2p)
Junction-to-ambient (@200 ft/min or 1 m/s) on single layer board (1s)
Junction-to-ambient (@200 ft/min or 1 m/s) on four layer board (2s2p)
Junction-to-board
Junction-to-case
Notes
1. Junction temperature is a function of die size, on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per JEDEC JESD51-6 with the board horizontal.
3. Thermal resistance between the die and the printed-circuit board per JEDEC JESD51-8. Board temperature is measured on
4. Thermal resistance between the active surface of the die and the case top surface determined by the cold plate method (MIL
temperature, ambient temperature, air flow, power dissipation of other components on the board, and board thermal
resistance
the top surface of the board near the package.
SPEC-883, Method 1012.1) with the calculated case temperature. Actual thermal resistance is less than 0.1 °C/W.
provides the package thermal characteristics.
Thermal Characteristics
Thermal Management Information
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
Minimum Platform Frequency Requirements for PCI Express, SRIO,
PCI interfaces Operation
2
---------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------------- -
×
(
0.80
)
×
Characteristic
(
serial RapidIO interface frequency
Table 87. Package Thermal Characteristics
527 MHz
----------------------------------------------------------------------------------------------
×
(
PCI Express link width
64
8
)
×
(
serial RapidIO link width
)
Symbol
R
R
R
R
R
R
θJA
θJA
θJA
θJA
θJB
θJC
Value
<0.1
21
17
16
13
9
)
°C/W
°C/W
•C/W
•C/W
•C/W
•C/W
Unit
C/W
C/W
C/W
C/W
Notes
Thermal
1, 2
1, 2
1, 2
1, 2
3
4
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