PPC8567EVTAUJJ Freescale Semiconductor, PPC8567EVTAUJJ Datasheet - Page 99

• Manufacturer Part Number: PPC8567EVTAUJJ
• Description: MCU PWRQUICC III 1023-FCPBGA
• Manufacturer: Freescale Semiconductor

Specifications of PPC8567EVTAUJJ

• Processor Type: MPC85xx PowerQUICC III 32-Bit
• Speed: 1.333GHz
• Voltage: 1.1V
• Mounting Type: Surface Mount
• Package / Case: 1023-BBGA, FCBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Features: -

22 Package and Pinout
This section details package parameters, pin assignments, and dimensions.
22.1
The package parameters are as provided in the following list. The package type is 33mm × 33mm, 1023
flip chip plastic ball grid array (FC-PBGA).
22.2
Figure 68
Freescale Semiconductor
Package outline
Interconnects
Pitch
Module height
Solder Balls
Ball diameter (typical)
Package Parameters for the MPC8568E FC-PBGA
Mechanical Dimensions of the MPC8568E FC-PBGA
shows the top view, bottom and side view of the MPC8568E 1023 FC-PBGA package.
MPC8568E/MPC8567E PowerQUICC III Integrated Processor Hardware Specifications, Rev. 1
1023
1 mm
2.23 – 2.75 mm
96.5% Sn 3.5% Ag
0.6 mm
33 mm × 33 mm
Package and Pinout
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