S34ML02G100BHI003 Spansion, S34ML02G100BHI003 Datasheet - Page 11

• Manufacturer Part Number: S34ML02G100BHI003
• Description: Flash 2G, 3V, 25ns NAND Flash
• Manufacturer: Spansion

Specifications of S34ML02G100BHI003

• Rohs: yes
• Data Bus Width: 1 bit
• Memory Type: NAND Flash
• Memory Size: 2 Gbit
• Architecture: Sectored
• Timing Type: Asynchronous
• Access Time: 25 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.7 V
• Maximum Operating Current: 40 mA
• Operating Temperature: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: BGA-63
• Organization: 2048 B x 8, 2048 B x 16

1.2
March 7, 2013 S34ML01G1_04G1_15
Connection Diagram
Note:
1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be
Note:
1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be
bonded internally.
bonded internally.
Figure 1.3 63-BGA Contact, x8 Device (Balls Down, Top View)
D a t a
Spansion
Figure 1.2 48-Pin TSOP1 Contact x8, x16 Devices
R/B#
WE#
WP#
VCC
RE#
CE#
VSS
CLE
ALE
x16
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
A1
B1
M1
L1
S h e e t
®
SLC NAND Flash Memory for Embedded
R/B#
VCC
WE#
WP#
VSS
RE#
CE#
CLE
ALE
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
x8
A2
NC
M2
L2
NC
NC
VCC
12
13
24
WP#
NC
V
1
C3
D3
E3
NC
F3
NC
G3
H3
NC
NC
J3
K3
SS
(1)
VCC
ALE
RE#
I/O0
I/O1
I/O2
NAND Flash
C4
D4
E4
NC
NC
G4
H4
F4
J4
K4
(1)
TSOP1
VSS
CLE
NC
I/O3
C5
D5
NC
NC
G5
H5
NC
NC
E5
F5
J5
K5
CE#
V
I/O4
NC
NC
NC
NC
G6
NC
C6
D6
E6
F6
H6
J6
K6
CC
VSS
WE#
NC
I/O5
I/O6
NC
NC
NC
48
37
36
25
C7
D7
E7
F7
G7
H7
K7
J7
(1)
RB#
NC
I/O7
V
C8
D8
NC
NC
NC
G8
H8
V
E8
F8
J8
K8
SS
VSS
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
VCC
NC
VCC
VSS
NC
VCC
NC
I/O3
I/O2
I/O1
I/O0
NC
NC
NC
VSS
cc
x8
(1)
(1)
(1)
(1)
NC
NC
NC
NC
A9
B9
L9
M9
VSS
I/O15
I/O14
I/O13
I/O7
I/O6
I/O5
I/O4
I/O12
VCC
NC
VCC
VSS
NC
VCC
I/011
I/O3
I/O2
I/O1
I/O0
I/O10
I/O9
I/O8
VSS
x16
A10
NC
B10
NC
M10
L10
NC
NC
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