S34ML02G100BHI003 Spansion, S34ML02G100BHI003 Datasheet - Page 71

• Manufacturer Part Number: S34ML02G100BHI003
• Description: Flash 2G, 3V, 25ns NAND Flash
• Manufacturer: Spansion

Specifications of S34ML02G100BHI003

• Rohs: yes
• Data Bus Width: 1 bit
• Memory Type: NAND Flash
• Memory Size: 2 Gbit
• Architecture: Sectored
• Timing Type: Asynchronous
• Access Time: 25 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.7 V
• Maximum Operating Current: 40 mA
• Operating Temperature: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: BGA-63
• Organization: 2048 B x 8, 2048 B x 16

10. Ordering Information
March 7, 2013 S34ML01G1_04G1_15
The ordering part number is formed by a valid combination of the following:
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
S34ML
Device
S34ML
Family
04G
Density
01G
02G
04G
1
00
Technology
D a t a
Spansion
1
T
F
S h e e t
®
Width
00, 04
Bus
SLC NAND Flash Memory for Embedded
I
Package
TF, BH
00
Type
Valid Combinations
0
Packing Type
0
3
Model Number
00
00
01
Temperature Range
I
Materials Set
F
H
Package
B
T
Bus Width
00
04
Technology
1
Density
01G =
02G =
04G =
Device Family
S34ML - 3V
Spansion SLC NAND Flash Memory for Embedded
Temperature
Range
=
=
=
=
=
=
=
=
=
=
=
=
=
I
ONFI (x16)
Tray
13” Tape and Reel
Standard Interface (x16)
Lead (Pb)-free
Low Halogen
BGA
TSOP
Spansion NAND Revision 1 (4x nm)
Standard Interface / ONFI (x8)
x8 NAND, single die
1 Gb
x16 NAND, single die
2 Gb
4 Gb
Industrial (–40°C to + 85°C)
Ordering Options
Additional
00, 01
Packing
Type
0, 3
Description
TSOP, BGA
Package
71