S34ML02G100BHI003 Spansion, S34ML02G100BHI003 Datasheet - Page 65

• Manufacturer Part Number: S34ML02G100BHI003
• Description: Flash 2G, 3V, 25ns NAND Flash
• Manufacturer: Spansion

Specifications of S34ML02G100BHI003

• Rohs: yes
• Data Bus Width: 1 bit
• Memory Type: NAND Flash
• Memory Size: 2 Gbit
• Architecture: Sectored
• Timing Type: Asynchronous
• Access Time: 25 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.7 V
• Maximum Operating Current: 40 mA
• Operating Temperature: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: BGA-63
• Organization: 2048 B x 8, 2048 B x 16

7. Physical Interface
7.1
March 7, 2013 S34ML01G1_04G1_15
7.1.1
Physical Diagram
48-Pin Thin Small Outline Package (TSOP1)
PACKAGE
SYMBOL
JEDEC
Figure 7.1 TS/TSR 48 — 48-lead Plastic Thin Small Outline, 12 x 20 mm, Package Outline
A1
A2
D1
b1
c1
Θ
A
b
D
E
e
L
R
N
c
19.80
18.30
11.90
0.05
0.95
0.17
0.17
0.10
0.10
0.50
0.08
MIN
---
0˚
MO-142 (D) DD
0.50 BASIC
TS/TSR 48
20.00
18.40
12.00
NOM
1.00
0.20
0.22
0.60
---
---
---
---
---
---
48
D a t a
Spansion
20.20
18.50
12.10
MAX
1.20
0.15
1.05
0.23
0.27
0.16
0.21
0.70
0.20
8
S h e e t
®
SLC NAND Flash Memory for Embedded
NOTES:
1.
2.
3.
4.
5.
6.
7.
8.
9.
CONTROLLING DIMENSIONS ARE IN MILLIMETERS (mm).
(DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y14.5M-1982)
PIN 1 IDENTIFIER FOR STANDARD PIN OUT (DIE UP).
PIN 1 IDENTIFIER FOR REVERSE PIN OUT (DIE DOWN): INK OR LASER MARK.
TO BE DETERMINED AT THE SEATING PLANE
DEFINED AS THE PLANE OF CONTACT THAT IS MADE WHEN THE PACKAGE LEADS
ARE ALLOWED TO REST FREELY ON A FLAT HORIZONTAL SURFACE.
DIMENSIONS D1 AND E DO NOT INCLUDE MOLD PROTRUSION. ALLOWABLE MOLD
PROTUSION IS 0.15mm (.0059") PER SIDE.
DIMENSION b DOES NOT INCLUDE DAMBAR PROTUSION. ALLOWABLE DAMBAR
PROTUSION SHALL BE 0.08mm (0.0031") TOTAL IN EXCESS OF b DIMENSION AT MAX.
MATERIAL CONDITION. MINIMUM SPACE BETWEEN PROTRUSION AND AN ADJACENT
LEAD TO BE 0.07mm (0.0028").
THESE DIMENSIONS APPLY TO THE FLAT SECTION OF THE LEAD BETWEEN
0.10mm (.0039") AND 0.25mm (0.0098") FROM THE LEAD TIP.
LEAD COPLANARITY SHALL BE WITHIN 0.10mm (0.004") AS MEASURED FROM
THE SEATING PLANE.
DIMENSION "e" IS MEASURED AT THE CENTERLINE OF THE LEADS.
-C- . THE SEATING PLANE IS
3664 \ f16-038.10 \ 11.6.7
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