S34ML02G100BHI003 Spansion, S34ML02G100BHI003 Datasheet - Page 66

• Manufacturer Part Number: S34ML02G100BHI003
• Description: Flash 2G, 3V, 25ns NAND Flash
• Manufacturer: Spansion

Specifications of S34ML02G100BHI003

• Rohs: yes
• Data Bus Width: 1 bit
• Memory Type: NAND Flash
• Memory Size: 2 Gbit
• Architecture: Sectored
• Timing Type: Asynchronous
• Access Time: 25 ns
• Supply Voltage - Max: 3.6 V
• Supply Voltage - Min: 2.7 V
• Maximum Operating Current: 40 mA
• Operating Temperature: - 40 C to + 85 C
• Mounting Style: SMD/SMT
• Package / Case: BGA-63
• Organization: 2048 B x 8, 2048 B x 16

66
7.1.2
63-Pin Ball Grid Array (BGA)
SYMBOL
PACKAGE
JEDEC
D X E
MD
ME
D1
Øb
eD
SD
SE
A1
E1
eE
A
D
E
n
Spansion
MIN
0.25
0.40
---
A3-A8,B2-B8,C1,C2,C9,C10
D1,D2,D9,D10,E1,E2,E9,E10
F1,F2,F9,F10,G1,G2,G9,G10
H1,H2,H9,H10,J1,J2,J9,J10
K1,K2,K9,K10,L3-L8,M3-M8
11.00 mm x 9.00 mm
M0-207(M)
PACKAGE
11.00 BSC
9.00 BSC
8.80 BSC
7.20 BSC
0.80 BSC
0.80 BSC
0.40 BSC
0.40 BSC
VBM 063
®
NOM
0.45
Figure 7.2 VBM063 — 63-Pin BGA, 11 mm x 9 mm Package
12
10
63
---
---
SLC NAND Flash Memory for Embedded
MAX
1.00
0.50
---
PROFILE
BALL HEIGHT
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
D a t a
NOTE
S h e e t
NOTES:
8.
9
2. ALL DIMENSIONS ARE IN MILLIMETERS.
3. BALL POSITION DESIGNATION PER JEP 95, SECTION 4.3,
4.
5. SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D" DIRECTION.
6
7
1. DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
SPP-010.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE "E" DIRECTION.
n IS THE NUMBER OF POPULATED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
S34ML01G1_04G1_15 March 7, 2013
g1018-1 \ f16-038.25 \ 11.04.11