HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 203

• Manufacturer Part Number: HD64F2338VFC25
• Description: MCU 3V 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2338VFC25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

6.5.7
When DRAM is accessed, RAS precharging time must be secured. With the chip, one T
always inserted when DRAM space is accessed. This can be changed to two T
the TPC bit in MCR to 1. Set the appropriate number of T
connected and the operating frequency of the chip. Figure 6.16 shows the timing when two T
states are inserted.
When the TCP bit is set to 1, two T
Read
Write
Note: n = 2 to 5
Precharge State Control
A
CS
CAS, LCAS
HWR (WE)
D
HWR (WE)
D
φ
23
15
15
n
to A
to D
to D
(RAS)
0
0
0
Figure 6.16 Timing with Two-State Precharge Cycle
T
p1
p
states are also used for refresh cycles.
T
p2
Rev.4.00 Sep. 07, 2007 Page 171 of 1210
p
Row
T
cycles according to the DRAM
r
T
c1
Column
p
states by setting
REJ09B0245-0400
T
c2
p
state is
p