HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 883

MCU 3V 256K 144-QFP

HD64F2338VFC25

Manufacturer Part Number
HD64F2338VFC25
Description
MCU 3V 256K 144-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of HD64F2338VFC25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
106
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 12x10b; D/A 4x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
144-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HD64F2338VFC25
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Crystal Resonator: Figure 20.3 shows the equivalent circuit of the crystal resonator. Use a crystal
resonator that has the characteristics shown in table 20.3 and the same resonance frequency as the
system clock (φ).
Table 20.3 Crystal Resonator Characteristics
Frequency (MHz)
R
C
Notes on Board Design: When a crystal resonator is connected, the following points should be
noted:
Other signal lines should be routed away from the oscillator circuit to prevent induction from
interfering with correct oscillation. See figure 20.4.
When designing the board, place the crystal resonator and its load capacitors as close as possible
to the XTAL and EXTAL pins.
S
0
max (pF)
max (Ω)
XTAL
Avoid
Figure 20.3 Crystal Resonator Equivalent Circuit
Figure 20.4 Example of Incorrect Board Design
2
500
7
C
C
L2
L1
L
Signal A Signal B
4
120
7
C
C
L
0
8
80
7
AT-cut parallel-resonance type
R
s
Rev.4.00 Sep. 07, 2007 Page 851 of 1210
Chip
12
60
7
XTAL
EXTAL
EXTAL
16
50
7
20
40
7
REJ09B0245-0400
25
40
7

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