HD64F2338VFC25 Renesas Electronics America, HD64F2338VFC25 Datasheet - Page 228

• Manufacturer Part Number: HD64F2338VFC25
• Description: MCU 3V 256K 144-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of HD64F2338VFC25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 106
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 12x10b; D/A 4x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -

6.10.4
Figure 6.37 shows the timing for transition to the bus-released state.
Rev.4.00 Sep. 07, 2007 Page 196 of 1210
REJ09B0245-0400
Address
bus
Data bus
AS
RD
HWR,
LWR
BREQ
BACK
BREQO*
[1] Low level of BREQ pin is sampled at fall of T
[2] BACK pin is driven low at end of CPU read cycle, releasing bus to external bus master.
[3] BREQ pin state is still sampled in external-bus-released state.
[4] High level of BREQ pin is sampled.
[5] BACK pin is driven high, ending bus release cycle.
[6] BREQO signal goes high 1.5 clocks after rise of BACK signal.
Note: * Output only when BREQOE = 1.
φ
Transition Timing
T
0
CPU cycle
Figure 6.37 Bus-Released State Transition Timing
T
Address
1
[1]
Minimum
1 state
T
2
[2]
2
state.
External-bus-released state
[3]
High impedance
High impedance
High impedance
High impedance
High impedance
[4]
[5]
CPU cycle
[6]