DF2161BVTE10 Renesas Electronics America, DF2161BVTE10 Datasheet - Page 592

• Manufacturer Part Number: DF2161BVTE10
• Description: MCU 3V 128K 144-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2161BVTE10

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 10MHz
• Connectivity: Host Interface (LPC), I²C, IrDA, SCI, X-Bus
• Peripherals: PWM, WDT
• Number Of I /o: 114
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2161BVTE10; HD64F2161BVTE10

Section 19 Host Interface LPC Interface (LPC)
Bit
0
Legend:
X:
Rev. 3.00 Mar 21, 2006 page 536 of 788
REJ09B0300-0300
Don't care
Bit Name Initial Value Slave Host Description
LSCIE
0
R/W
R/W
—
LSCI output Enable
Controls LSCI output in combination with the LSCIB
bit in HICR1. LSCI pin output is open-drain, and an
external pull-up resistor is needed to pull the output
up to V
When the LSCI output function is used, the DDR bit
for PB1 must not be set to 1.
LSCIE
0
1
1
CC
LSCIB
x: LSCI output disabled, other function of
0: LSCI output enabled, LSCI pin output
1: LSCI output enabled, LSCI pin output is
pin is enabled
goes to 0 level
high-impedance