DF2161BVTE10 Renesas Electronics America, DF2161BVTE10 Datasheet - Page 87

• Manufacturer Part Number: DF2161BVTE10
• Description: MCU 3V 128K 144-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2161BVTE10

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 10MHz
• Connectivity: Host Interface (LPC), I²C, IrDA, SCI, X-Bus
• Peripherals: PWM, WDT
• Number Of I /o: 114
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-TQFP, 144-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2161BVTE10; HD64F2161BVTE10

Section 2 CPU
Stack structure
In advanced mode, when the program counter (PC) is pushed onto the stack in a subroutine
call, and the PC and condition-code register (CCR) are pushed onto the stack in exception
handling, they are stored as shown in figure 2.4. The extended control register (EXR) is not
pushed onto the stack. For details, see section 4, Exception Handling.
Reserved
SP
CCR
SP
PC
PC
(24 bits)
(24 bits)
(a) Subroutine Branch
(b) Exception Handling
Figure 2.4 Stack Structure in Advanced Mode
Rev. 3.00 Mar 21, 2006 page 31 of 788
REJ09B0300-0300