MC9S12E128CPVE Freescale Semiconductor, MC9S12E128CPVE Datasheet - Page 87

• Manufacturer Part Number: MC9S12E128CPVE
• Description: IC MCU 128K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12E128CPVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Processor Series: S12E
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: SCI/SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 92
• Number Of Timers: 12
• Operating Supply Voltage: 3.135 V to 5.5 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• On-chip Dac: 2-ch x 8-bit
• Controller Family/series: HCS12/S12X
• No. Of I/o's: 90
• Ram Memory Size: 8KB
• Cpu Speed: 25MHz
• No. Of Timers: 4
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• For Use With: M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

2.3
This section describes the FTS128K1 memory map and registers.
2.3.1
The FTS128K1 memory map is shown in
addresses between 0x4000 and 0xFFFF, which corresponds to three 16 Kbyte pages. The content of the
HCS12 Core PPAGE register is used to map the logical middle page ranging from address 0x8000 to
0xBFFF to any physical 16K byte page in the Flash array memory.
2.3.2.5) can be set to globally protect the entire Flash array. Three separate areas, one starting from the
Flash array starting address (called lower) towards higher addresses, one growing downward from the
Flash array end address (called higher), and the remaining addresses, can be activated for protection. The
Flash array addresses covered by these protectable regions are shown in
area is mainly targeted to hold the boot loader code since it covers the vector space. The lower address area
can be used for EEPROM emulation in an MCU without an EEPROM module since it can be left
unprotected while the remaining addresses are protected from program or erase. Default protection
settings as well as security information that allows the MCU to restrict access to the Flash module are
stored in the Flash configuration field described in
1. By placing 0x3E/0x3F in the HCS12 Core PPAGE register, the bottom/top fixed 16 Kbyte pages can be seen twice in the MCU
Freescale Semiconductor
memory map.
0xFF08–0xFF0C
0xFF00–0xFF07
Memory Map and Registers
Flash Address
Module Memory Map
0xFF0D
0xFF0E
0xFF0F
(bytes)
Size
8
5
1
1
1
Table 2-1. Flash Configuration Field
Backdoor Key to unlock security
Reserved
Flash Protection byte
Refer to
Reserved
Flash Security/Options byte
Refer to
MC9S12E128 Data Sheet, Rev. 1.07
Figure
Section 2.3.2.5, “Flash Protection Register (FPROT)”
Section 2.3.2.2, “Flash Security Register (FSEC)”
2-2. The HCS12 architecture places the Flash array
Table
2-1.
Description
Chapter 2 128 Kbyte Flash Module (FTS128K1V1)
1
The FPROT register (see
Figure
2-2. The higher address
Section
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