MC9S08QG4MPAE Freescale Semiconductor, MC9S08QG4MPAE Datasheet - Page 19

• Manufacturer Part Number: MC9S08QG4MPAE
• Description: IC MCU 4K FLASH 8-PDIP
• Manufacturer: Freescale Semiconductor
• Series: HCS08r

Specifications of MC9S08QG4MPAE

• Core Processor: HCS08
• Core Size: 8-Bit
• Speed: 20MHz
• Connectivity: I²C, SCI, SPI
• Peripherals: LVD, POR, PWM, WDT
• Number Of I /o: 4
• Program Memory Size: 4KB (4K x 8)
• Program Memory Type: FLASH
• Ram Size: 256 x 8
• Voltage - Supply (vcc/vdd): 1.8 V ~ 3.6 V
• Data Converters: A/D 4x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 125°C
• Package / Case: 8-DIP (0.300", 7.62mm)
• Controller Family/series: HCS08
• No. Of I/o's: 6
• Ram Memory Size: 256Byte
• Cpu Speed: 20MHz
• No. Of Timers: 2
• Embedded Interface Type: I2C, SCI, SPI
• Rohs Compliant: Yes
• Processor Series: S08QG
• Core: HCS08
• Data Bus Width: 8 bit
• Data Ram Size: 256 B
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 20 MHz
• Number Of Programmable I/os: 12
• Number Of Timers: 1
• Maximum Operating Temperature: + 125 C
• Mounting Style: Through Hole
• 3rd Party Development Tools: EWS08
• Development Tools By Supplier: DEMO9S08QG8E
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 8 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

Section Number
17.3 On-Chip Debug System (DBG) .................................................................................................... 252
17.4 Register Definition ........................................................................................................................ 256
A.1 Introduction ....................................................................................................................................265
A.2 Absolute Maximum Ratings...........................................................................................................265
A.3 Thermal Characteristics..................................................................................................................266
A.4 ESD Protection and Latch-Up Immunity .......................................................................................268
A.5 DC Characteristics..........................................................................................................................269
A.6 Supply Current Characteristics.......................................................................................................272
A.7 External Oscillator (XOSC) and Internal Clock Source (ICS) Characteristics..............................274
A.8 AC Characteristics..........................................................................................................................276
A.9 Analog Comparator (ACMP) Electricals .......................................................................................282
A.10 ADC Characteristics.......................................................................................................................282
A.11 FLASH Specifications....................................................................................................................285
A.12 EMC Performance..........................................................................................................................286
B.1 Ordering Information .....................................................................................................................289
B.2 Mechanical Drawings.....................................................................................................................289
Freescale Semiconductor
17.2.4 BDC Hardware Breakpoint..............................................................................................251
17.3.1 Comparators A and B ......................................................................................................252
17.3.2 Bus Capture Information and FIFO Operation ................................................................252
17.3.3 Change-of-Flow Information ...........................................................................................253
17.3.4 Tag vs. Force Breakpoints and Triggers ..........................................................................253
17.3.5 Trigger Modes..................................................................................................................254
17.3.6 Hardware Breakpoints .....................................................................................................256
17.4.1 BDC Registers and Control Bits ......................................................................................256
17.4.2 System Background Debug Force Reset Register (SBDFR)...........................................258
17.4.3 DBG Registers and Control Bits......................................................................................259
A.8.1 Control Timing ................................................................................................................276
A.8.2 TPM/MTIM Module Timing ...........................................................................................277
A.8.3 SPI Timing .......................................................................................................................278
A.12.1 Radiated Emissions..........................................................................................................286
A.12.2 Conducted Transient Susceptibility .................................................................................286
B.1.1 Device Numbering Scheme .............................................................................................289
Ordering Information and Mechanical Drawings
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Electrical Characteristics
Appendix A
Appendix B
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