MC9S08QG4MPAE Freescale Semiconductor, MC9S08QG4MPAE Datasheet - Page 248

IC MCU 4K FLASH 8-PDIP

MC9S08QG4MPAE

Manufacturer Part Number
MC9S08QG4MPAE
Description
IC MCU 4K FLASH 8-PDIP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08QG4MPAE

Core Processor
HCS08
Core Size
8-Bit
Speed
20MHz
Connectivity
I²C, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
4
Program Memory Size
4KB (4K x 8)
Program Memory Type
FLASH
Ram Size
256 x 8
Voltage - Supply (vcc/vdd)
1.8 V ~ 3.6 V
Data Converters
A/D 4x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 125°C
Package / Case
8-DIP (0.300", 7.62mm)
Controller Family/series
HCS08
No. Of I/o's
6
Ram Memory Size
256Byte
Cpu Speed
20MHz
No. Of Timers
2
Embedded Interface Type
I2C, SCI, SPI
Rohs Compliant
Yes
Processor Series
S08QG
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
256 B
Interface Type
I2C, SCI, SPI
Maximum Clock Frequency
20 MHz
Number Of Programmable I/os
12
Number Of Timers
1
Maximum Operating Temperature
+ 125 C
Mounting Style
Through Hole
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMO9S08QG8E
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 8 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Development Support
driven speedup pulses to force rapid rise times on this pin without risking harmful drive level conflicts.
Refer to
Section 17.2.2, “Communication
Details,”
for more detail.
When no debugger pod is connected to the 6-pin BDM interface connector, the internal pullup on BKGD
chooses normal operating mode. When a debug pod is connected to BKGD it is possible to force the MCU
into active background mode after reset. The specific conditions for forcing active background depend
upon the HCS08 derivative (refer to the introduction to this Development Support section). It is not
necessary to reset the target MCU to communicate with it through the background debug interface.
17.2.2
Communication Details
The BDC serial interface requires the external controller to generate a falling edge on the BKGD pin to
indicate the start of each bit time. The external controller provides this falling edge whether data is
transmitted or received.
BKGD is a pseudo-open-drain pin that can be driven either by an external controller or by the MCU. Data
is transferred MSB first at 16 BDC clock cycles per bit (nominal speed). The interface times out if
512 BDC clock cycles occur between falling edges from the host. Any BDC command that was in progress
when this timeout occurs is aborted without affecting the memory or operating mode of the target MCU
system.
The custom serial protocol requires the debug pod to know the target BDC communication clock speed.
The clock switch (CLKSW) control bit in the BDC status and control register allows the user to select the
BDC clock source. The BDC clock source can either be the bus or the alternate BDC clock source.
The BKGD pin can receive a high or low level or transmit a high or low level. The following diagrams
show timing for each of these cases. Interface timing is synchronous to clocks in the target BDC, but
asynchronous to the external host. The internal BDC clock signal is shown for reference in counting
cycles.
Figure 17-2
shows an external host transmitting a logic 1 or 0 to the BKGD pin of a target HCS08 MCU.
The host is asynchronous to the target so there is a 0-to-1 cycle delay from the host-generated falling edge
to where the target perceives the beginning of the bit time. Ten target BDC clock cycles later, the target
senses the bit level on the BKGD pin. Typically, the host actively drives the pseudo-open-drain BKGD pin
during host-to-target transmissions to speed up rising edges. Because the target does not drive the BKGD
pin during the host-to-target transmission period, there is no need to treat the line as an open-drain signal
during this period.
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
246
Freescale Semiconductor

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