MC9S12E256VPVE Freescale Semiconductor, MC9S12E256VPVE Datasheet - Page 565

• Manufacturer Part Number: MC9S12E256VPVE
• Description: IC MCU 256K FLASH 25MHZ 112-LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12E256VPVE

• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 91
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 2.35 V ~ 2.75 V
• Data Converters: A/D 16x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 105°C
• Package / Case: 112-LQFP
• Processor Series: S12E
• Core: HCS12
• Data Bus Width: 16 bit
• Data Ram Size: 16 KB
• Interface Type: I2C/SCI/SPI
• Maximum Clock Frequency: 50 MHz
• Number Of Programmable I/os: 92
• Number Of Timers: 12
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: EWHCS12
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 16-ch x 10-bit
• On-chip Dac: 2-ch x 8-bit
• For Use With: M68EVB912E128 - BOARD EVAL FOR MC9S12E128/64
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Two cases with internal voltage regulator enabled and disabled must be considered:
1
2
3
Freescale Semiconductor
Num
The values for thermal resistance are achieved by package simulations
PC Board according to EIA/JEDEC Standard 51-3
PC Board according to EIA/JEDEC Standard 51-7
10
1
2
3
4
5
6
7
8
9
1. Internal Voltage Regulator disabled
2. Internal voltage regulator enabled
Which is the sum of all output currents on I/O ports associated with VDDX and VDDM.
For R
respectively
I
additionally contains the current flowing into the external loads with output high.
Which is the sum of all output currents on I/O ports associated with VDDX and VDDR.
DDR
R
R
P
P
C
T
T
T
T
T
T
T
T
T
T
P
P
IO
DSON
DSON
INT
INT
IO
is the current shown in
DSON
=
Thermal Resistance LQFP112, single sided PCB
Thermal Resistance LQFP112, double sided PCB
Junction to Board LQFP112
Junction to Case LQFP112
Junction to Package Top LQFP112
Thermal Resistance QFP 80, single sided PCB
Thermal Resistance QFP 80, double sided PCB
Junction to Board QFP80
Junction to Case QFP80
Junction to Package Top QFP80
=
=
=
∑
∑
with 2 internal planes
with 2 internal planes
I
I
i
i
=
=
DDR
is valid:
DD
R
R
V
----------- - for outputs driven low
V
----------------------------------- - for outputs driven high
I
OL
DSON
DSON
OL
DD5
V
V
DD
I
;
OH
DDR
–
+
V
I
Table A-5. Thermal Package Characteristics
I
OH
I
IO i
IO i
DDPLL
+
I
Rating
2
;
2
DDA
3
Table A-8
MC9S12E256 Data Sheet, Rev. 1.08
V
V
DDPLL
DDA
and not the overall current flowing into VDDR, which
+
I
DDA
2
V
DDA
Symbol
JC
JC
JA
JA
JB
JA
JA
JB
JT
JT
Min
—
—
—
—
—
—
—
—
—
—
1
Appendix A Electrical Characteristics
Typ
—
—
—
—
—
—
—
—
—
—
Max
54
41
31
11
51
41
27
14
2
3
°
°
°
°
o
o
o
o
o
o
Unit
o
o
o
o
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
C/W
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