ST7FMC2R6T6 STMicroelectronics, ST7FMC2R6T6 Datasheet - Page 288

MCU 8BIT 32K FLASH 64TQFP

ST7FMC2R6T6

Manufacturer Part Number
ST7FMC2R6T6
Description
MCU 8BIT 32K FLASH 64TQFP
Manufacturer
STMicroelectronics
Series
ST7r
Datasheet

Specifications of ST7FMC2R6T6

Core Processor
ST7
Core Size
8-Bit
Speed
8MHz
Connectivity
LINSCI, SPI
Peripherals
LVD, Motor Control PWM, POR, PWM, WDT
Number Of I /o
44
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
1K x 8
Voltage - Supply (vcc/vdd)
3.8 V ~ 5.5 V
Data Converters
A/D 16x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
64-TQFP, 64-VQFP
Processor Series
ST7FMC2x
Core
ST7
Data Bus Width
8 bit
Data Ram Size
1 KB
Interface Type
SCI, SPI
Maximum Clock Frequency
8 MHz
Number Of Programmable I/os
60
Number Of Timers
3
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Development Tools By Supplier
ST7MC-KIT/BLDC, ST7MDT50-EMU3, STX-RLINK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit, 16 Channel
For Use With
497-8402 - BOARD EVAL COMPLETE INVERTER497-8400 - KIT IGBT PWR MODULE CTRL ST7MC497-6408 - BOARD EVAL BLDC SENSORLESS MOTOR497-4734 - EVAL KIT 3KW POWER DRIVER BOARD497-4733 - EVAL KIT 1KW POWER DRIVER BOARD497-4732 - EVAL KIT 300W POWER DRIVER BOARD497-4731 - EVAL KIT PWR DRIVER CONTROL BRD
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
 Details
Other names
497-4868

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
ST7FMC2R6T6
Manufacturer:
STMicroelectronics
Quantity:
10 000
Part Number:
ST7FMC2R6T6
Manufacturer:
ST
0
ST7MC1xx/ST7MC2xx
PACKAGE CHARACTERISTICS (Cont’d)
13.2 THERMAL CHARACTERISTICS
Notes:
1. The maximum chip-junction temperature is based on technology characteristics.
2. The maximum power dissipation is obtained from the formula P
The power dissipation of an application can be defined by the user with the formula: P
where P
the ports used in the application.
288/309
Symbol
P
INT
T
R
Dmax
Jmax
thJA
is the chip internal power (I
Package thermal resistance (junction to ambient)
Maximum junction temperature
Power dissipation
2)
DD
x V
Ratings
DD
) and P
1)
PORT
LQFP80 14x14
LQFP64 14x14
LQFP44 10x10
SDIP32 400mil
SDIP56 600mil
LQFP32 7x7
is the port power dissipation depending on
D
= (T
J
-T
A
) / R
Value
thJA
150
500
55
55
68
80
63
45
.
D
=P
INT
+P
°C/W
Unit
mW
°C
PORT

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