ST7FMC2R6T6 STMicroelectronics, ST7FMC2R6T6 Datasheet - Page 289

• Manufacturer Part Number: ST7FMC2R6T6
• Description: MCU 8BIT 32K FLASH 64TQFP
• Manufacturer: STMicroelectronics
• Series: ST7r

Specifications of ST7FMC2R6T6

• Core Processor: ST7
• Core Size: 8-Bit
• Speed: 8MHz
• Connectivity: LINSCI, SPI
• Peripherals: LVD, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 44
• Program Memory Size: 32KB (32K x 8)
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3.8 V ~ 5.5 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-TQFP, 64-VQFP
• Processor Series: ST7FMC2x
• Core: ST7
• Data Bus Width: 8 bit
• Data Ram Size: 1 KB
• Interface Type: SCI, SPI
• Maximum Clock Frequency: 8 MHz
• Number Of Programmable I/os: 60
• Number Of Timers: 3
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Development Tools By Supplier: ST7MC-KIT/BLDC, ST7MDT50-EMU3, STX-RLINK
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• For Use With: 497-8402 - BOARD EVAL COMPLETE INVERTER497-8400 - KIT IGBT PWR MODULE CTRL ST7MC497-6408 - BOARD EVAL BLDC SENSORLESS MOTOR497-4734 - EVAL KIT 3KW POWER DRIVER BOARD497-4733 - EVAL KIT 1KW POWER DRIVER BOARD497-4732 - EVAL KIT 300W POWER DRIVER BOARD497-4731 - EVAL KIT PWR DRIVER CONTROL BRD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details
• Other names: 497-4868

13.3 SOLDERING INFORMATION
In accordance with the RoHS European directive,
all STMicroelectronics packages have been con-
verted to lead-free technology, named ECO-
PACK
■
■
Table 90. Soldering Compatibility (wave and reflow soldering process)
* Assemblers must verify that the Pb-package maximum temperature (mentioned on the Inner box label)
is compatible with their Lead-free soldering process.
SDIP & PDIP
LQFP and SO
ECOPACK
to the JEDEC STD-020C compliant soldering
profile.
Detailed information on the STMicroelectronics
ECOPACK
www.st.com/stonline/leadfree/,
technical Application notes covering the main
technical
conversion
AN2036).
Package
TM
.
TM
TM
aspects
(AN2033,
transition program is available on
packages are qualified according
Sn (pure Tin)
NiPdAu (Nickel-palladium-Gold)
related
Plating material devices
AN2034,
with
to
lead-free
AN2035,
specific
Backward and forward compatibility:
The main difference between Pb and Pb-free sol-
dering process is the temperature range.
– ECOPACK
– LQFP, SDIP and SO Pb-packages are compati-
are fully compatible with Lead (Pb) containing
soldering process (see application note AN2034)
ble with Lead-free soldering process, neverthe-
less it's the customer's duty to verify that the Pb-
packages maximum temperature (mentioned on
the Inner box label) is compatible with their Lead-
free soldering temperature.
Pb solder paste
Yes
Yes
TM
LQFP, SDIP and SO packages
ST7MC1xx/ST7MC2xx
Pb-free solder paste
Yes *
Yes *
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