UPD78F9502MA-CAC-A NEC, UPD78F9502MA-CAC-A Datasheet - Page 211

• Manufacturer Part Number: UPD78F9502MA-CAC-A
• Description: 8BIT MCU, 4K FLASH, 128B RAM, SMD
• Manufacturer: NEC

Specifications of UPD78F9502MA-CAC-A

• Controller Family/series: UPD78F
• No. Of I/o's: 8
• Ram Memory Size: 128Byte
• Cpu Speed: 10MHz
• No. Of Timers: 2
• No. Of Pwm: RoHS Compliant
• Core Size: 8bit
• Program Memory Size: 4KB
• Oscillator Type: External, Internal

Cautions 1.
Note After opening the dry pack, store it at 25 C or less and 65% RH or less for the allowable storage period.
Caution Do not use different soldering methods together (except for partial heating).
Infrared reflow
Wave soldering
Partial heating
Soldering Method
These products should be soldered and mounted under the following recommended conditions.
For technical information, see the following website.
Semiconductor Device Mount Manual (http://www.necel.com/pkg/en/mount/index.html)
10-pin plastic SSOP (lead-free products)
PD78F9500MA-CAC-A, 78F9501MA-CAC-A, 78F9502MA-CAC-A
2. For soldering methods and conditions other than those recommended below, contact an NEC
Products whis –A at the end of the part number are lead-free products.
Electronics sales representative.
Package peak temperature: 260 C, Time: 30 seconds max. (at 210 C or higher),
Count: 3 times or less, Exposure limit: 7 days
10 to 72 hours)
For details, contact an NEC Electronics sales representative.
Pin temperature: 350 C max., Time: 3 seconds max. (per pin row)
CHAPTER 18 RECOMMENDED SOLDERING CONDITIONS
Table 18-1. Surface Mounting Type Soldering Conditions
Preliminary User’s Manual U18681EJ1V0UD
Soldering Conditions
Note
(after that, prebake at 125 C for
IR60-107-3
Condition Symbol
Recommended
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