MC9S12XEQ512CAL Freescale Semiconductor, MC9S12XEQ512CAL Datasheet - Page 213

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MC9S12XEQ512CAL

Manufacturer Part Number
MC9S12XEQ512CAL
Description
MCU 16BIT 512K FLASH 112-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS12r
Datasheet

Specifications of MC9S12XEQ512CAL

Core Processor
HCS12X
Core Size
16-Bit
Speed
50MHz
Connectivity
CAN, EBI/EMI, I²C, IrDA, SCI, SPI
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
91
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
32K x 8
Voltage - Supply (vcc/vdd)
1.72 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
112-LQFP
No. Of I/o's
91
Eeprom Memory Size
4KB
Ram Memory Size
32KB
Cpu Speed
50MHz
No. Of Timers
3
No. Of Pwm Channels
8
Digital Ic Case Style
LQFP
Rohs Compliant
Yes
Processor Series
S12XE
Core
HCS12
Data Bus Width
16 bit
Data Ram Size
32 KB
Interface Type
CAN, SCI, SPI
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
91
Number Of Timers
25
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWHCS12
Development Tools By Supplier
KIT33812ECUEVME, EVB9S12XEP100, DEMO9S12XEP100
Minimum Operating Temperature
- 40 C
On-chip Adc
12 bit, 16 Channel
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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3.4.2.3
The global memory spaces reserved for the internal resources (RAM, EEE, and FLASH) are not
determined by the MMC module. Size of the individual internal resources are however fixed in the design
of the device cannot be changed by the user. Please refer to the Device User Guide for further details.
Figure 3-19
the memory spaces have fixed top addresses.
When the device is operating in expanded modes except emulation single-chip mode, accesses to global
addresses which are not occupied by the on-chip resources (unimplemented areas or external memory
space) result in accesses to the external bus (see
Freescale Semiconductor
Because of an order from the United States International Trade Commission, BGA-packaged product lines and partnumbers
indicated here currently are not available from Freescale for import or sale in the United States prior to September 2010
Bit22
Bit22
and
Implemented Memory Map
Table 3-17
BDMGPR Register [6:0]
BDMGPR Register [6:0]
1. RAMSIZE is the hexadecimal value of RAM SIZE in bytes
2. FLASHSIZE is the hexadecimal value of FLASH SIZE in bytes
Internal Resource
FLASH
show the memory spaces occupied by the on-chip resources. Please note that
RAM
Table 3-17. Global Implemented Memory Space
MC9S12XE-Family Reference Manual Rev. 1.23
Figure 3-18. BDMGPR Address Mapping
BDM HARDWARE COMMAND
BDM FIRMWARE COMMAND
Global Address [22:0]
Global Address [22:0]
Bit16
Bit16
FLASH_LOW = 0x80_0000 minus FLASHSIZE
RAM_LOW = 0x10_0000 minus RAMSIZE
Bit15
Bit15
Figure
3-19).
$Address
BDM Local Address
Chapter 3 Memory Mapping Control (S12XMMCV4)
CPU Local Address
(1)
(2)
Bit0
Bit0
213

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