D13008VXI25V Renesas Electronics America, D13008VXI25V Datasheet - Page 17

MCU 3V 0K I-TEMP PB-FREE 100-TQF

D13008VXI25V

Manufacturer Part Number
D13008VXI25V
Description
MCU 3V 0K I-TEMP PB-FREE 100-TQF
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13008VXI25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
Item
19.3 AC
Characteristics
Table 19.6 Bus Timing
19.4 A/D Conversion
Characteristics
Table 19.8 A/D
Conversion
Characteristics
C.7 Port B Block
Diagrams
Figure C.7 (a) Port B
Block Diagram (Pins
PB
Figure C.7 (b) Port B
Block Diagram (Pins
PB
0
1
and PB
and PB
2
3
)
)
Page
481, 482 Table amended
486
616
617
Revision (See Manual for Details)
Note added
Figure amended
Figure amended
Item
Read data setup time
Read data hold time
Write data delay time
Write data setup time 1
Write data setup time 2
Write data hold time
Read data access time 1
Read data access time 2
Read data access time 3
Read data access time 4
Precharge time 1
Precharge time 2
Symbol Min
t
t
t
t
t
PB
t
t
t
t
t
t
t
RDS
RDH
WDD
WDS1
WDS2
WDH
ACC1
ACC2
ACC3
ACC4
PCH1
PCH2
PBn
n
Rev.4.00 Aug. 20, 2007, Page xv of xliv
0.5 t
1.0 t
2.0 t
1.0 t
0.5 t
25
0
−30
−30
−15
−20
−20
cyc
cyc
cyc
cyc
cyc
A
2.0 t
−45
3.0 t
−45
1.5 t
−45
2.5 t
−45
Max
35
Condition
cyc
cyc
cyc
cyc
Min
25
0
1.0 t
−30
2.0 t
−30
0.5 t
−15
1.0 t
−20
0.5 t
−20
B and C
cyc
cyc
cyc
cyc
cyc
Max
35
2.0 t
−45
3.0 t
−45
1.5 t
−45
2.5 t
−45
cyc
cyc
cyc
cyc
REJ09B0395-0400
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Test Conditions
Figure 19.7,
figure 19.8
Figure 19.7,
figure 19.8

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