D13008VXI25V Renesas Electronics America, D13008VXI25V Datasheet - Page 76

MCU 3V 0K I-TEMP PB-FREE 100-TQF

D13008VXI25V

Manufacturer Part Number
D13008VXI25V
Description
MCU 3V 0K I-TEMP PB-FREE 100-TQF
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13008VXI25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
2. CPU
Table 2.3
Instruction Size*
MOV
MOVFPE
MOVTPE
POP
PUSH
Note:
Rev.4.00 Aug. 20, 2007 Page 30 of 638
REJ09B0395-0400
* Size refers to the operand size.
B: Byte
W: Word
L:
B/W/L
B
B
W/L
W/L
Data Transfer Instructions
Longword
Function
(EAs) → Rd, Rs → (EAd)
Moves data between two general registers or between a general register and
memory, or moves immediate data to a general register.
(EAs) → Rd
Cannot be used in the H8/3008.
Rs → (EAs)
Cannot be used in the H8/3008.
@SP+ → Rn
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. Similarly, POP.L ERn is identical to MOV.L @SP+, ERn.
Rn → @−SP
Pushes a general register onto the stack. PUSH.W Rn is identical to MOV.W
Rn, @−SP. Similarly, PUSH.L ERn is identical to MOV.L ERn, @−SP.

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