D13008VXI25V Renesas Electronics America, D13008VXI25V Datasheet - Page 496

MCU 3V 0K I-TEMP PB-FREE 100-TQF

D13008VXI25V

Manufacturer Part Number
D13008VXI25V
Description
MCU 3V 0K I-TEMP PB-FREE 100-TQF
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13008VXI25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
17. Clock Pulse Generator
Table 17.1 (2)
External Capacitance Value
Frequency f (MHz)
C
Crystal Resonator: Figure 17.3 shows an equivalent circuit of the crystal resonator. The crystal
resonator should have the characteristics listed in table 17.2.
Table 17.2 Crystal Resonator Parameters
Frequency (MHz)
Rs max (Ω)
Co (pF)
Use a crystal resonator with a frequency equal to the system clock frequency (φ).
Notes on Board Design: When a crystal resonator is connected, the following points should be
noted:
Other signal lines should be routed away from the oscillator circuit to prevent induction from
interfering with correct oscillation. See figure 17.4.
When the board is designed, the crystal resonator and its load capacitors should be placed as close
as possible to the XTAL and EXTAL pins.
Rev.4.00 Aug. 20, 2007 Page 450 of 638
REJ09B0395-0400
L1
XTAL
= C
L2
(pF)
External Capacitance Values
Figure 17.3 Crystal Resonator Equivalent Circuit
2
500
L
4
120
5 V Version
20 < f ≤ 25
10
C
8
80
L
10
70
2 ≤ f ≤ 20
10 to 22
C
0
7 pF max
12
60
AT-cut parallel-resonance type
16
50
3 V Version
2 ≤ f ≤ 16
22
Rs
18
40
20
40
16 ≤ f ≤ 25
10
EXTAL
25
40

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