D13008VXI25V Renesas Electronics America, D13008VXI25V Datasheet - Page 98

• Manufacturer Part Number: D13008VXI25V
• Description: MCU 3V 0K I-TEMP PB-FREE 100-TQF
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13008VXI25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

2. CPU
2.9.3
The on-chip supporting modules are accessed in three states. The data bus is 8 or 16 bits wide,
depending on the internal I/O register being accessed. Figure 2.17 shows the on-chip supporting
module access timing. Figure 2.18 indicates the pin states.
Rev.4.00 Aug. 20, 2007 Page 52 of 638
REJ09B0395-0400
Figure 2.16 Pin States during On-Chip Memory Access (Address Update Mode 1)
On-Chip Supporting Module Access Timing
Address bus
φ
Internal address bus
Internal read signal
Internal data bus
(read access)
Internal write signal
Internal data bus
(write access)
φ
AS
D
15
,
to D
RD HWR LWR
,
0
Figure 2.15 On-Chip Memory Access Cycle
,
High
T state
1
T
1
High impedance
Bus cycle
Address
Address
Read data
Write data
T state
2
T
2