D13008VXI25V Renesas Electronics America, D13008VXI25V Datasheet - Page 487

MCU 3V 0K I-TEMP PB-FREE 100-TQF

D13008VXI25V

Manufacturer Part Number
D13008VXI25V
Description
MCU 3V 0K I-TEMP PB-FREE 100-TQF
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13008VXI25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
An example of D/A conversion on channel 0 is given next. Timing is indicated in figure 15.2.
1. Data to be converted is written in DADR0.
2. Bit DAOE0 is set to 1 in DACR. D/A conversion starts and DA
3. If the DADR0 value is modified, conversion starts immediately, and the result is output after
4. When the DAOE0 bit is cleared to 0, DA0 becomes an input pin.
φ
Address
DADR0
DAOE0
DA
Legend:
t
DCONV
converted result is output after the conversion time.
The output value is
Output of this conversion result continues until the value in DADR0 is modified or the
DAOE0 bit is cleared to 0.
the conversion time.
0
: D/A conversion time
DADR0
write cycle
High-impedance state
Figure 15.2 Example of D/A Converter Operation
DADR contents
DACR
write cycle
256
Conversion data 1
t
DCONV
× V
REF
Conversion
result 1
Rev.4.00 Aug. 20, 2007 Page 441 of 638
DADR0
write cycle
0
becomes an output pin. The
t
DCONV
Conversion data 2
15. D/A Converter
REJ09B0395-0400
Conversion
result 2
DACR
write cycle

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