D13008VXI25V Renesas Electronics America, D13008VXI25V Datasheet - Page 520

MCU 3V 0K I-TEMP PB-FREE 100-TQF

D13008VXI25V

Manufacturer Part Number
D13008VXI25V
Description
MCU 3V 0K I-TEMP PB-FREE 100-TQF
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13008VXI25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
19. Electrical Characteristics
Notes: 1. Do not open the pin connections of the AV
Rev.4.00 Aug. 20, 2007 Page 474 of 638
REJ09B0395-0400
2. Given current consumption values are when all the output pins are made to unloaded
3. I
is not in use.
Connect the AV
respectively.
state and, furthermore, when the on-chip pull-up MOS is turned off under conditions
that V
Also, the aforesaid current consumption values are when V
max = 0.3 V under the condition of V
I
I
Also, the typ. values for current dissipation are reference values.
CC
CC
CC
max. (under normal operations) = 3.0 (mA) + 0.40 (mA/(MHz × V)) × V
max. (when using the sleeve)
max. (when the sleeve + module are standing by)
IH
min = V
CC
CC
−0.5 V and V
and V
REF
pins to the V
IL
max = 0.5 V.
= 3.0 (mA) + 0.32 (mA/(MHz × V)) × V
= 3.0 (mA) + 0.25 (mA/(MHz × V)) × V
RAM
CC
≤ V
and connect the AV
CC
CC
, V
< 4.5 V.
REF
and AV
SS
IH
pins while the A/D converter
min = V
SS
pin to the V
CC
× 0.9 and V
CC
CC
CC
SS
,
× f
× f
× f
IL

Related parts for D13008VXI25V