D13008VXI25V Renesas Electronics America, D13008VXI25V Datasheet - Page 673

• Manufacturer Part Number: D13008VXI25V
• Description: MCU 3V 0K I-TEMP PB-FREE 100-TQF
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of D13008VXI25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 35
• Program Memory Type: ROMless
• Ram Size: 4K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Program Memory Size: -

Timing of Transition to Hardware Standby Mode
1. To retain RAM contents with the RAME bit set to 1 in SYSCR, drive the RES signal low 10
2. To retain RAM contents with the RAME bit cleared to 0 in SYSCR, RES does not have to be
Timing of Recovery from Hardware Standby Mode: Drive the RES signal low approximately
100 ns before STBY goes high.
STBY
RES
STBY
RES
Appendix E Timing of Transition to and Recovery from
system clock cycles before the STBY signal goes low, as shown below. RES must remain low
until STBY goes low (minimum delay from STBY low to RES high: 0 ns).
driven low as in (1).
Appendix E Timing of Transition to and Recovery from Hardware Standby Mode
Hardware Standby Mode
t
1
t ≥ 100 ns
≥ 10t
cyc
t
2
≥ 0 ns
Rev.4.00 Aug. 20, 2007 Page 627 of 638
t
OSC
REJ09B0395-0400