D13008VXI25V Renesas Electronics America, D13008VXI25V Datasheet - Page 525

MCU 3V 0K I-TEMP PB-FREE 100-TQF

D13008VXI25V

Manufacturer Part Number
D13008VXI25V
Description
MCU 3V 0K I-TEMP PB-FREE 100-TQF
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13008VXI25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
19.3
Clock timing parameters are listed in table 19.4, control signal timing parameters in table 19.5,
and bus timing parameters in table 19.6. Timing parameters of the on-chip supporting modules are
listed in table 19.7.
Table 19.4 Clock Timing
Condition:
Condition A: V
Condition B: V
Condition C: V
Item
Clock cycle time
Clock pulse low
width
Clock pulse high
width
Clock rise time
Clock fall time
Clock oscillator
settling time at
reset
Clock oscillator
settling time in
software standby
AC Characteristics
T
specifications)
fmax = 25 MHz
fmax = 20 MHz
fmax = 25 MHz
a
CC
CC
CC
= −20°C to +75°C (regular specifications), T
= 3.0 to 3.6 V, AV
= 5.0 V ±10%, AV
= 5.0 V ±10%, AV
t
Symbol Min
t
t
t
t
t
t
cyc
CL
CH
Cr
Cf
OSC1
OSC2
40
10
10
20
7
CC
A
CC
CC
500
10
10
Max
= 3.0 to 3.6 V, V
= 5.0 V ±10%, V
= 5.0 V ±10%, V
Min
50
15
15
20
7
Condition
B
Max
500
10
10
REF
REF
REF
Rev.4.00 Aug. 20, 2007 Page 479 of 638
= 3.0 to AV
= 4.5 to AV
= 4.5 to AV
a
= −40°C to +85°C (wide-range
Min
40
10
10
20
7
19. Electrical Characteristics
CC
C
CC
CC
Max
500
10
10
, V
, V
, V
SS
SS
SS
= AV
= AV
= AV
REJ09B0395-0400
Unit
ns
ns
ns
ns
ns
ms
ms
SS
SS
SS
= 0 V,
= 0 V,
= 0 V,
Test
Conditions
Figure 19.3
to
figure 19.15
Figure 19.3
Figure 18.1

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