D13008VXI25V Renesas Electronics America, D13008VXI25V Datasheet - Page 52

MCU 3V 0K I-TEMP PB-FREE 100-TQF

D13008VXI25V

Manufacturer Part Number
D13008VXI25V
Description
MCU 3V 0K I-TEMP PB-FREE 100-TQF
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of D13008VXI25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
1. Overview
1.3
1.3.1
The pin arrangement of the H8/3008 is shown in figures 1.2 and 1.3. Differences in the H8/3008
pin arrangements are shown in table 1.2. Except for the differences shown in table 1.2, the pin
arrangements are the same.
Table 1.2
Package
Rev.4.00 Aug. 20, 2007 Page 6 of 638
REJ09B0395-0400
FP-100B
(TFP-100B)
Pin Arrangement
Pin Description
Comparison of H8/3008 Pin Arrangements
Pin
Number
1
10
H8/3064
F-ZTAT
B-Mask
Version
5 V
FWE
V
CL
H8/3026
F-ZTAT
3 V
V
FWE
CC
5 V
H8/3062
F-ZTAT
B-Mask
Version
V
FWE
CL
Operation Model
H8/3024
F-ZTAT
3 V
V
FWE
CC
H8/3008 ROMless
5 V
V
RESO
CL
3 V
V
RESO
CC

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