D13008VXI25V Renesas Electronics America, D13008VXI25V Datasheet - Page 396
D13008VXI25V
Manufacturer Part Number
D13008VXI25V
Description
MCU 3V 0K I-TEMP PB-FREE 100-TQF
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of D13008VXI25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
35
Program Memory Type
ROMless
Ram Size
4K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Program Memory Size
-
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12. Serial Communication Interface
Table 12.7 Maximum Bit Rates with External Clock Input (Synchronous Mode)
φ (MHz)
2
4
6
8
10
12
14
16
18
20
25
12.3
12.3.1
The SCI can carry out serial communication in two modes: asynchronous mode in which
synchronization is achieved character by character, and synchronous mode in which
synchronization is achieved with clock pulses. A smart card interface is also supported as a serial
communication function for an IC card interface.
Selection of asynchronous or synchronous mode and the transmission format for the normal serial
communication interface is made in SMR, as shown in table 12.8. The SCI clock source is
selected by the C/A bit in SMR and the CKE1 and CKE0 bits in SCR, as shown in table 12.9.
For details of the procedures for switching between LSB-first and MSB-first mode and inverting
the data logic level, see section 13.2.1, Smart Card Mode Register (SCMR).
For selection of the smart card interface format, see section 13.3.3, Data Format.
Rev.4.00 Aug. 20, 2007 Page 350 of 638
REJ09B0395-0400
Operation
Overview
External Input Clock (MHz)
0.3333
0.6667
1.0000
1.3333
1.6667
2.0000
2.3333
2.6667
3.0000
3.3333
4.1667
Maximum Bit Rate (bit/s)
333333.3
666666.7
1000000.0
1333333.3
1666666.7
2000000.0
2333333.3
2666666.7
3000000.0
3333333.3
4166666.7
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