EP3C16F256I7N Altera, EP3C16F256I7N Datasheet - Page 402

• Manufacturer Part Number: EP3C16F256I7N
• Description: Cyclone III
• Manufacturer: Altera

Package Information for Cyclone III Devices
Thermal
Resistance
Package
Outlines
Document
Revision History
15–2
Cyclone III Device Handbook, Volume 1
Date and Document Version
March 2007 v1.0
Table 15–2. Document Revision History
For thermal resistance specifications for Cyclone III devices, refer to the
Cyclone Series Device Thermal Resistance Data
Cyclone III device package outlines can be downloaded from the
Packaging Specifications
Table 15–2
Notes to
(1)
(2)
Initial Release
EP3C120 FineLine Ball-Grid Array (FBGA) – Option 3 – Wire Bond
Table 15–1. Cyclone III Device Package Options (Part 2 of 2)
EP3C55
EP3C80
Device
The E144 package has an exposed pad at the bottom of the package. This exposed
pad is a ground pad that must be connected to the ground plane on your PCB.
This exposed pad is used for electrical connectivity and not for thermal purposes.
The package type entries with "Option #" refer to instances where multiple
package options exist for a given package type and pin count. The Option number
identifies the specific type used by the corresponding device density.
Table
shows the revision history for this document.
FineLine Ball-Grid Array (FBGA) – Option 3 – Wire Bond
Ultra FineLine Ball-Grid Array (UBGA) – Wire Bond
FineLine Ball-Grid Array (FBGA) – Option 2 – Wire Bond
FineLine Ball-Grid Array (FBGA) – Option 3 – Wire Bond
Ultra FineLine Ball-Grid Array (UBGA) - Wire Bond
FineLine Ball-Grid Array (FBGA) – Option 2 – Wire Bond
FineLine Ball-Grid Array (FBGA) – Option 2 – Wire Bond
15–1:
Changes Made
web page.
Package
(2)
Sheet.
N/A
Summary of Changes
Altera Corporation
March 2007
Device
Pins
484
484
780
484
484
780
484
780