MC9S08JM32CLD Freescale Semiconductor, MC9S08JM32CLD Datasheet - Page 369

IC MCU 8BIT 32K FLASH 44-LQFP

MC9S08JM32CLD

Manufacturer Part Number
MC9S08JM32CLD
Description
IC MCU 8BIT 32K FLASH 44-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08JM32CLD

Core Processor
HCS08
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SCI, SPI, USB
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-LQFP
Processor Series
S08JM
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
33
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMOJM, DEMOJMSKT, DEMOFLEXISJMSD, DEMO9S08JM16
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC9S08JM32CLD
Manufacturer:
Freescale Semiconductor
Quantity:
1 948
Part Number:
MC9S08JM32CLD
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Part Number:
MC9S08JM32CLD
0
A.13 Flash Specifications
This section provides details about program/erase times and program-erase endurance for the flash
memory.
Program and erase operations do not require any special power sources other than the normal V
For more detailed information about program/erase operations.
Freescale Semiconductor
1
Num
Typical values are based on characterization data at V
10
1
2
3
4
5
6
7
8
9
(CPOL = 0)
(CPOL = 1)
(OUTPUT)
(INPUT)
C
C
(INPUT)
(INPUT)
(INPUT)
NOTE:
MISO
MOSI
SCK
SCK
1. Not defined but normally LSB of character just received
SS
Supply voltage for program/erase
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/FCLK)
Byte program time (random location)
Byte program time (burst mode)
Page erase time
Mass erase time
Program/erase endurance
Data retention
T
T = 25°C
L
to T
H
NOTE
= –40°C to + 85°C
SEE
Characteristic
8
5
3
(2)
Figure A-13. SPI Slave Timing (CPHA = 1)
2
SLAVE
4
5
6
MC9S08JM60 Series Data Sheet, Rev. 3
10
Table A-16. Flash Characteristics
MSB IN
2
1
4
MSB OUT
7
5
(2)
4
(2)
DD
V
= 5.0 V, 25°C unless otherwise stated.
11
BIT 6 . . . 1
Symbol
prog/erase
BIT 6 . . . 1
V
f
t
t
t
t
t
t
FCLK
Burst
Page
Mass
D_ret
Fcyc
prog
Read
10,000
Min
150
2.7
2.7
15
5
SLAVE LSB OUT
3
20,000
Appendix A Electrical Characteristics
4000
100,000
Typ
9
4
100
LSB IN
1
Max
6.67
200
5.5
5.5
9
cycles
DD
years
Unit
t
t
t
t
kHz
Fcyc
Fcyc
Fcyc
Fcyc
μs
V
V
supply.
369

Related parts for MC9S08JM32CLD