MC9S08JM32CLD Freescale Semiconductor, MC9S08JM32CLD Datasheet - Page 51

IC MCU 8BIT 32K FLASH 44-LQFP

MC9S08JM32CLD

Manufacturer Part Number
MC9S08JM32CLD
Description
IC MCU 8BIT 32K FLASH 44-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08JM32CLD

Core Processor
HCS08
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SCI, SPI, USB
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-LQFP
Processor Series
S08JM
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
33
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMOJM, DEMOJMSKT, DEMOFLEXISJMSD, DEMO9S08JM16
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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0
The RAM retains data when the MCU is in low-power wait, stop2, or stop3 mode. At power-on, the
contents of RAM are uninitialized. RAM data is unaffected by any reset provided that the supply voltage
does not drop below the minimum value for RAM retention.
For compatibility with older M68HC05 MCUs, the HCS08 resets the stack pointer to 0x00FF. In the
MC9S08JM60 series, it is usually best to re-initialize the stack pointer to the top of the RAM so the direct
page RAM can be used for frequently accessed RAM variables and bit-addressable program variables.
Include the following 2-instruction sequence in your reset initialization routine (where RamLast is equated
to the highest address of the RAM in the Freescale-provided equate file).
LDHX
TXS
When security is enabled, the RAM is considered a secure memory resource and is not accessible through
BDM or through code executing from non-secure memory. See
description of the security feature.
4.4
USB RAM is discussed in detail in
4.5
The flash memory is used for program storage. In-circuit programming allows the operating program to
be loaded into the flash memory after final assembly of the application product. It is possible to program
the entire array through the single-wire background debug interface. Because no special voltages are
needed for flash erase and programming operations, in-application programming is also possible through
other software-controlled communication paths. For a more detailed discussion of in-circuit and
in-application programming, refer to the HCS08 Family Reference Manual, Volume I, Freescale
Semiconductor document order number HCS08RMv1.
4.5.1
Features of the flash memory include:
Freescale Semiconductor
Flash size
— MC9S08JM60 — 60,912 bytes (119 pages of 512 bytes each)
— MC9S08JM32 — 32,768 bytes (64 pages of 512 bytes each)
Single power supply program and erase
Command interface for fast program and erase operation
Up to 100,000 program/erase cycles at typical voltage and temperature
Flexible block protection
Security feature for flash and RAM
Auto power-down for low-frequency read accesses
USB RAM
Flash
#RamLast+1
Features
;point one past RAM
;SP<-(H:X-1)
MC9S08JM60 Series Data Sheet, Rev. 3
Chapter 17, “Universal Serial Bus Device Controller
Section 4.6,
“Security,” for a detailed
(S08USBV1).”
Chapter 4 Memory
51

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