MC9S08JM32CLD Freescale Semiconductor, MC9S08JM32CLD Datasheet - Page 370

IC MCU 8BIT 32K FLASH 44-LQFP

MC9S08JM32CLD

Manufacturer Part Number
MC9S08JM32CLD
Description
IC MCU 8BIT 32K FLASH 44-LQFP
Manufacturer
Freescale Semiconductor
Series
HCS08r
Datasheet

Specifications of MC9S08JM32CLD

Core Processor
HCS08
Core Size
8-Bit
Speed
48MHz
Connectivity
I²C, LIN, SCI, SPI, USB
Peripherals
LVD, POR, PWM, WDT
Number Of I /o
33
Program Memory Size
32KB (32K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 5.5 V
Data Converters
A/D 8x12b
Oscillator Type
External
Operating Temperature
-40°C ~ 85°C
Package / Case
44-LQFP
Processor Series
S08JM
Core
HCS08
Data Bus Width
8 bit
Data Ram Size
2 KB
Interface Type
SCI/SPI
Maximum Clock Frequency
24 MHz
Number Of Programmable I/os
33
Number Of Timers
8
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
EWS08
Development Tools By Supplier
DEMOJM, DEMOJMSKT, DEMOFLEXISJMSD, DEMO9S08JM16
Minimum Operating Temperature
- 40 C
On-chip Adc
8-ch x 12-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

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Appendix A Electrical Characteristics
A.14 USB Electricals
The USB electricals for the S08USBV1 module conform to the standards documented by the Universal
Serial Bus Implementers Forum. For the most up-to-date standards, visit http://www.usb.org.
If the Freescale S08USBV1 implementation has electrical characteristics that deviate from the standard or
require additional information, this space would be used to communicate that information.
A.15 EMC Performance
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the
MCU resides. Board design and layout, circuit topology choices, location and characteristics of external
components as well as MCU software operation all play a significant role in EMC performance. The
system designer must consult Freescale applications notes such as AN2321, AN1050, AN1263, AN2764,
and AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
A.15.1
Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell
method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed
with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test
software. The radiated emissions from the microcontroller are measured in a TEM cell in two package
orientations (North and East). For more detailed information concerning the evaluation results, conditions
and setup, please refer to the EMC Evaluation Report for this device.
The maximum radiated RF emissions of the tested configuration in all orientations are less than or equal
to the reported emissions levels.
370
2
3
4
5
The frequency of this clock is controlled by a software setting.
These values are hardware state machine controlled. User code does not need to count cycles. This information
supplied for calculating approximate time to program and erase.
Typical endurance for Flash is based on the intrinsic bitcell performance. For additional information on how
Freescale Semiconductor defines typical endurance, please refer to Engineering Bulletin EB619/D, Typical
Endurance for Nonvolatile Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and
de-rated to 25 °C using the Arrhenius equation. For additional information on how Freescale Semiconductor defines
typical data retention, please refer to Engineering Bulletin EB618/D, Typical Data Retention for Nonvolatile Memory.
Regulator operating voltage
VREG output
V
VREG disabled
VREG Quiescent Current
USB33
Radiated Emissions
input with internal
Table A-17. Internal USB 3.3V Voltage Regulator Characteristics
MC9S08JM60 Series Data Sheet, Rev. 3
Symbol
V
V
V
usb33in
I
regout
VRQ
regin
Unit
mA
V
V
V
Min
3.9
3
3
Typ
3.3
3.3
0.5
Freescale Semiconductor
Max
5.5
3.6
3.6

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