MC9S12NE64CPV Freescale Semiconductor, MC9S12NE64CPV Datasheet - Page 547

• Manufacturer Part Number: MC9S12NE64CPV
• Description: IC MCU 25MHZ ETHERNT/PHY 112LQFP
• Manufacturer: Freescale Semiconductor
• Series: HCS12r

Specifications of MC9S12NE64CPV

• Mfg Application Notes: MC9S12NE64 Integrated Ethernet Controller Implementing an Ethernet Interface with the MC9S12NE64 Web Server Development with MC9S12NE64 and Open TCP
• Core Processor: HCS12
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: EBI/EMI, Ethernet, I²C, SCI, SPI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.375 V ~ 3.465 V
• Data Converters: A/D 8x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 112-LQFP
• Data Bus Width: 16 bit
• Data Ram Size: 8 KB
• Interface Type: I2C, SCI, SPI
• Maximum Clock Frequency: 25 MHz
• Number Of Programmable I/os: 70
• Number Of Timers: 16 bit
• Operating Supply Voltage: - 0.3 V to + 3 V
• Maximum Operating Temperature: + 105 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 65 C
• On-chip Adc: 10 bit
• For Use With: EVB9S12NE64E - BOARD EVAL FOR 9S12NE64DEMO9S12NE64E - DEMO BOARD FOR 9S12NE64
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: No RoHS Version Available

B.2.2.1
The MC9S12NE64 requires a 1:1 ratio for the high-speed LAN magnetics isolation module for both the
receive and the transmit signals. Because the MC9S12NE64 does not implement Auto-MDIX, an
Auto-MDIX capable high-speed LAN magnetics isolation module is not required. A high-speed LAN
magnetics isolation module with improved return loss characteristics is recommended to avoid Ethernet
return loss issues.
B.2.2.2
The 80-pin TQFP-EP package has an exposed flag for heat dissipation and requires special PCB layout to
accommodate the flag. There are two ways to accommodate the flag:
The requirement is to have about 50% of the flag soldered to the PC board.
Freescale Semiconductor
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All termination resistors should be near to the driving source. The MCU is the driving source for
PHY_TXP and PHY_TXN pins. The high-speed LAN magnetics isolation module is the driving
source for PHY_RXP and PHY_RXN pins.
4-layer PCBs recommended to provide better heat dissipation
Have a hatched pattern in the solder mask
Use small copper areas under the flag
High-Speed LAN Magnetics Isolation Module Requirements
80-Pin Package Exposed Flag
MC9S12NE64 Data Sheet, Rev. 1.1
PCB Design Recommendation
547